Indium Phosphide Photonic Circuits on Silicon Electronics

K.A. Williams; X. Liu; M. Matters-Kammerer; A. Meighan; M. Spiegelberg; J.J.G.M. van der Tol; M. Trajkovic; M.J. Wale; W. Yao; X. Zhang

Indium Phosphide Photonic Circuits on Silicon Electronics

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

Samenvatting

The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

Originele taal-2	Engels
Titel	2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings
Uitgeverij	Institute of Electrical and Electronics Engineers
Aantal pagina's	3
ISBN van elektronische versie	9781943580712
Status	Gepubliceerd - 13 mei 2020
Evenement	The Optical Networking and Communication Conference & Exhibition (OFC2020) - San Diego, Verenigde Staten van Amerika Duur: 8 mrt. 2020 → 12 mrt. 2020 https://www.ofcconference.org/en-us/home/

Congres

Congres	The Optical Networking and Communication Conference & Exhibition (OFC2020)
Verkorte titel	OFC2020
Land/Regio	Verenigde Staten van Amerika
Stad	San Diego
Periode	8/03/20 → 12/03/20
Internet adres	https://www.ofcconference.org/en-us/home/

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Williams, K. A., Liu, X., Matters-Kammerer, M., Meighan, A., Spiegelberg, M., van der Tol, J. J. G. M., Trajkovic, M., Wale, M. J., Yao, W., & Zhang, X. (2020). Indium Phosphide Photonic Circuits on Silicon Electronics. In 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings Artikel 9083390 Institute of Electrical and Electronics Engineers. https://ieeexplore.ieee.org/document/9083390

@inproceedings{f1555284ebd54b53a665904a8bb3bbc0,

title = "Indium Phosphide Photonic Circuits on Silicon Electronics",

abstract = "The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.",

author = "K.A. Williams and X. Liu and M. Matters-Kammerer and A. Meighan and M. Spiegelberg and \{van der Tol\}, J.J.G.M. and M. Trajkovic and M.J. Wale and W. Yao and X. Zhang",

year = "2020",

month = may,

day = "13",

language = "English",

booktitle = "2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2020 Optical Fiber Communications Conference and Exhibition, OFC 2020, OFC 2020 ; Conference date: 08-03-2020 Through 12-03-2020",

url = "https://www.ofcconference.org/en-us/home/",

}

Williams, KA, Liu, X, Matters-Kammerer, M, Meighan, A, Spiegelberg, M , van der Tol, JJGM , Trajkovic, M , Wale, MJ , Yao, W & Zhang, X 2020, Indium Phosphide Photonic Circuits on Silicon Electronics. in 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings., 9083390, Institute of Electrical and Electronics Engineers, The Optical Networking and Communication Conference & Exhibition (OFC2020), San Diego, California, Verenigde Staten van Amerika, 8/03/20. <https://ieeexplore.ieee.org/document/9083390>

Indium Phosphide Photonic Circuits on Silicon Electronics. / Williams, K.A.; Liu, X.; Matters-Kammerer, M. et al.
2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings. Institute of Electrical and Electronics Engineers, 2020. 9083390.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Indium Phosphide Photonic Circuits on Silicon Electronics

AU - Williams, K.A.

AU - Liu, X.

AU - Matters-Kammerer, M.

AU - Meighan, A.

AU - Spiegelberg, M.

AU - van der Tol, J.J.G.M.

AU - Trajkovic, M.

AU - Wale, M.J.

AU - Yao, W.

AU - Zhang, X.

PY - 2020/5/13

Y1 - 2020/5/13

N2 - The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

AB - The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

UR - https://www.scopus.com/pages/publications/85085181691

M3 - Conference contribution

AN - SCOPUS:85085181691

BT - 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020

Y2 - 8 March 2020 through 12 March 2020

ER -

Indium Phosphide Photonic Circuits on Silicon Electronics

Samenvatting

Congres

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