Indium Phosphide Photonic Circuits on Silicon Electronics

K. A. Williams; X. Liu; M. Matters-Kammerer; A. Meighan; M. Spiegelberg; J. J.G.M. Van Der Tol; M. Trajkovic; M. J. Wale; W. Yao; X. Zhang

Indium Phosphide Photonic Circuits on Silicon Electronics

K. A. Williams, X. Liu, M. Matters-Kammerer, A. Meighan, M. Spiegelberg, J. J.G.M. Van Der Tol, M. Trajkovic, M. J. Wale, W. Yao, X. Zhang

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

2 Citaten (Scopus)

Samenvatting

The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

Originele taal-2	Engels
Titel	2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings
Uitgeverij	Institute of Electrical and Electronics Engineers
Aantal pagina's	3
ISBN van elektronische versie	9781943580712
ISBN van geprinte versie	9781943580712
Status	Gepubliceerd - 13 mei 2020
Evenement	2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - San Diego, Verenigde Staten van Amerika Duur: 8 mrt 2020 → 12 mrt 2020

Congres

Congres	2020 Optical Fiber Communications Conference and Exhibition, OFC 2020
Land	Verenigde Staten van Amerika
Stad	San Diego
Periode	8/03/20 → 12/03/20

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https://ieeexplore.ieee.org/document/9083390

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Citeer dit

Williams, K. A., Liu, X., Matters-Kammerer, M., Meighan, A., Spiegelberg, M., Van Der Tol, J. J. G. M., Trajkovic, M., Wale, M. J., Yao, W., & Zhang, X. (2020). Indium Phosphide Photonic Circuits on Silicon Electronics. In 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings [9083390] Institute of Electrical and Electronics Engineers. https://ieeexplore.ieee.org/document/9083390

@inproceedings{f1555284ebd54b53a665904a8bb3bbc0,

title = "Indium Phosphide Photonic Circuits on Silicon Electronics",

abstract = "The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.",

author = "Williams, {K. A.} and X. Liu and M. Matters-Kammerer and A. Meighan and M. Spiegelberg and {Van Der Tol}, {J. J.G.M.} and M. Trajkovic and Wale, {M. J.} and W. Yao and X. Zhang",

year = "2020",

month = may,

day = "13",

language = "English",

isbn = "9781943580712",

booktitle = "2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 ; Conference date: 08-03-2020 Through 12-03-2020",

}

Williams, KA , Liu, X , Matters-Kammerer, M , Meighan, A , Spiegelberg, M , Van Der Tol, JJGM , Trajkovic, M , Wale, MJ , Yao, W & Zhang, X 2020, Indium Phosphide Photonic Circuits on Silicon Electronics. in 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings., 9083390, Institute of Electrical and Electronics Engineers, 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020, San Diego, Verenigde Staten van Amerika, 8/03/20. <https://ieeexplore.ieee.org/document/9083390>

Indium Phosphide Photonic Circuits on Silicon Electronics. / Williams, K. A.; Liu, X.; Matters-Kammerer, M.; Meighan, A.; Spiegelberg, M.; Van Der Tol, J. J.G.M.; Trajkovic, M.; Wale, M. J.; Yao, W.; Zhang, X.

2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings. Institute of Electrical and Electronics Engineers, 2020. 9083390.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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T1 - Indium Phosphide Photonic Circuits on Silicon Electronics

AU - Williams, K. A.

AU - Liu, X.

AU - Matters-Kammerer, M.

AU - Meighan, A.

AU - Spiegelberg, M.

AU - Van Der Tol, J. J.G.M.

AU - Trajkovic, M.

AU - Wale, M. J.

AU - Yao, W.

AU - Zhang, X.

PY - 2020/5/13

Y1 - 2020/5/13

N2 - The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

AB - The intimate integration of photonics and electronics in transceivers facilitates energy-efficiency, bandwidth acceleration and a route to radical miniaturization. We present and implement a wafer-to-wafer integration method which combines electronic and photonic foundry technologies.

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SN - 9781943580712

BT - 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 2020 Optical Fiber Communications Conference and Exhibition, OFC 2020

Y2 - 8 March 2020 through 12 March 2020

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