Improving the thermal management of AC-DC converters using integration technologies

E.C.W. de Jong, J. A. Ferreira, P. Bauer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

10 Citaten (Scopus)

Samenvatting

Thermal management plays a pivotal role in achieving high power densities in converters. By incorporating integration technologies into, and on, the PCB structure, improvement in power density and thermal performance of critical components are achieved without the addition of extra, expensive material. Better use of the already available PCB copper, layout and packaging technology is utilised to gain the advantages proposed. Theory to evaluate the thermal management efficiency is applied to a case study flyback converter that has been geometrically integrated and thermally revised. The improvement of the thermal management efficiency in conjunction with a geometrical integration process forms the core of the paper, validated by experimental measurements.
Originele taal-2Engels
TitelConference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's2315-2322
ISBN van geprinte versie0-7803-8486-5
DOI's
StatusGepubliceerd - 1 nov. 2004
Extern gepubliceerdJa
Evenement2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting - Seattle, Verenigde Staten van Amerika
Duur: 3 okt. 20047 okt. 2004

Congres

Congres2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting
Land/RegioVerenigde Staten van Amerika
StadSeattle
Periode3/10/047/10/04

Vingerafdruk

Duik in de onderzoeksthema's van 'Improving the thermal management of AC-DC converters using integration technologies'. Samen vormen ze een unieke vingerafdruk.

Citeer dit