III-V photonic integrated circuits for beyond-telecom applications

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In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.
Originele taal-2Engels
Titel 2016 25th Wireless and Optical Communication Conference (WOCC 2016
Subtitel Proceedings of a meeting held 21-23 May 2016, Chengdu, China.
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's5
ISBN van geprinte versie9781467399593
DOI's
StatusGepubliceerd - jul 2016

Vingerafdruk

Photonics
Integrated circuits
Telecommunication
Membranes

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Jiao, Y., Shen, L., Cao, Z., Latkowski, S., Bente, E. A. J. M., van der Tol, J. J. G. M., ... Williams, K. A. (2016). III-V photonic integrated circuits for beyond-telecom applications. In 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China. Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/WOCC.2016.7506591
Jiao, Y. ; Shen, L. ; Cao, Z. ; Latkowski, S. ; Bente, E.A.J.M. ; van der Tol, J.J.G.M. ; Smit, M.K. ; Williams, K.A. / III-V photonic integrated circuits for beyond-telecom applications. 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Piscataway : Institute of Electrical and Electronics Engineers, 2016.
@inproceedings{6c3681aa69724e92b09129d70c496cf2,
title = "III-V photonic integrated circuits for beyond-telecom applications",
abstract = "In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.",
author = "Y. Jiao and L. Shen and Z. Cao and S. Latkowski and E.A.J.M. Bente and {van der Tol}, J.J.G.M. and M.K. Smit and K.A. Williams",
year = "2016",
month = "7",
doi = "10.1109/WOCC.2016.7506591",
language = "English",
isbn = "9781467399593",
booktitle = "2016 25th Wireless and Optical Communication Conference (WOCC 2016",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",

}

Jiao, Y, Shen, L, Cao, Z, Latkowski, S, Bente, EAJM, van der Tol, JJGM, Smit, MK & Williams, KA 2016, III-V photonic integrated circuits for beyond-telecom applications. in 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Institute of Electrical and Electronics Engineers, Piscataway. https://doi.org/10.1109/WOCC.2016.7506591

III-V photonic integrated circuits for beyond-telecom applications. / Jiao, Y.; Shen, L.; Cao, Z.; Latkowski, S.; Bente, E.A.J.M.; van der Tol, J.J.G.M.; Smit, M.K.; Williams, K.A.

2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Piscataway : Institute of Electrical and Electronics Engineers, 2016.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

TY - GEN

T1 - III-V photonic integrated circuits for beyond-telecom applications

AU - Jiao, Y.

AU - Shen, L.

AU - Cao, Z.

AU - Latkowski, S.

AU - Bente, E.A.J.M.

AU - van der Tol, J.J.G.M.

AU - Smit, M.K.

AU - Williams, K.A.

PY - 2016/7

Y1 - 2016/7

N2 - In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.

AB - In this paper we introduce the III-V photonic integration platforms for emerging applications beyond telecommunications. Recent achievements in InP generic platform and InP membrane platform for wireless and sensing applications are reviewed. These realized chips show great potential of the InP-based photonic integration for its full functionality, high flexibility and high performance.

U2 - 10.1109/WOCC.2016.7506591

DO - 10.1109/WOCC.2016.7506591

M3 - Conference contribution

SN - 9781467399593

BT - 2016 25th Wireless and Optical Communication Conference (WOCC 2016

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Jiao Y, Shen L, Cao Z, Latkowski S, Bente EAJM, van der Tol JJGM et al. III-V photonic integrated circuits for beyond-telecom applications. In 2016 25th Wireless and Optical Communication Conference (WOCC 2016: Proceedings of a meeting held 21-23 May 2016, Chengdu, China.. Piscataway: Institute of Electrical and Electronics Engineers. 2016 https://doi.org/10.1109/WOCC.2016.7506591