Uittreksel
| Originele taal-2 | Engels |
|---|---|
| Titel | Handbook of 3D integration |
| Subtitel | volume 4: design, test, and thermal management |
| Redacteuren | P.D. Franzon, E.J. Marinissen, M.S. Bakir |
| Plaats van productie | Weinheim |
| Uitgeverij | Wiley-VCH Verlag |
| Hoofdstuk | 14 |
| Pagina's | 301-323 |
| Aantal pagina's | 23 |
| ISBN van geprinte versie | 978-3-527-33855-9 |
| DOI's | |
| Status | Gepubliceerd - 8 feb 2019 |
Citeer dit
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IEEE Std P1838: 3D test access standard under development. / Cron, Adam; Marinissen, Erik Jan; Goel, Sandeep K.; McLaurin, Teresa; Bhatia, Sandeep.
Handbook of 3D integration: volume 4: design, test, and thermal management. redactie / P.D. Franzon; E.J. Marinissen; M.S. Bakir. Weinheim : Wiley-VCH Verlag, 2019. blz. 301-323.Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Hoofdstuk › Academic › peer review
TY - CHAP
T1 - IEEE Std P1838: 3D test access standard under development
AU - Cron, Adam
AU - Marinissen, Erik Jan
AU - Goel, Sandeep K.
AU - McLaurin, Teresa
AU - Bhatia, Sandeep
PY - 2019/2/8
Y1 - 2019/2/8
N2 - IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.
AB - IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.
U2 - 10.1002/9783527697052.ch14
DO - 10.1002/9783527697052.ch14
M3 - Chapter
SN - 978-3-527-33855-9
SP - 301
EP - 323
BT - Handbook of 3D integration
A2 - Franzon, P.D.
A2 - Marinissen, E.J.
A2 - Bakir, M.S.
PB - Wiley-VCH Verlag
CY - Weinheim
ER -