IEEE Std P1838: 3D test access standard under development

Adam Cron; Erik Jan Marinissen; Sandeep K. Goel; Teresa McLaurin; Sandeep Bhatia

doi:10.1002/9783527697052.ch14

IEEE Std P1838: 3D test access standard under development

Adam Cron, Erik Jan Marinissen, Sandeep K. Goel, Teresa McLaurin, Sandeep Bhatia

Electronic Systems

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Hoofdstuk › Academic › peer review

Samenvatting

IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.

Originele taal-2	Engels
Titel	Handbook of 3D integration
Subtitel	volume 4: design, test, and thermal management
Redacteuren	P.D. Franzon, E.J. Marinissen, M.S. Bakir
Plaats van productie	Weinheim
Uitgeverij	Wiley-VCH Verlag
Hoofdstuk	14
Pagina's	301-323
Aantal pagina's	23
ISBN van geprinte versie	978-3-527-33855-9
DOI's	https://doi.org/10.1002/9783527697052.ch14
Status	Gepubliceerd - 8 feb 2019

Toegang tot document

10.1002/9783527697052.ch14

Citeer dit

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title = "IEEE Std P1838: 3D test access standard under development",

abstract = "IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.",

author = "Adam Cron and Marinissen, {Erik Jan} and Goel, {Sandeep K.} and Teresa McLaurin and Sandeep Bhatia",

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IEEE Std P1838: 3D test access standard under development. / Cron, Adam; Marinissen, Erik Jan; Goel, Sandeep K.; McLaurin, Teresa; Bhatia, Sandeep.

Handbook of 3D integration: volume 4: design, test, and thermal management. redactie / P.D. Franzon; E.J. Marinissen; M.S. Bakir. Weinheim : Wiley-VCH Verlag, 2019. blz. 301-323.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Hoofdstuk › Academic › peer review

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