Samenvatting
IEEE Std P1838 is striving to implement a flexible architecture, allowing access to die‐level DfT structures embedded within a stack of die. Access to these structures should be available at the die level, through all levels of manufacturing as each die is stacked upon the next, and finally at the package level.
Originele taal-2 | Engels |
---|---|
Titel | Handbook of 3D integration |
Subtitel | volume 4: design, test, and thermal management |
Redacteuren | P.D. Franzon, E.J. Marinissen, M.S. Bakir |
Plaats van productie | Weinheim |
Uitgeverij | Wiley-VCH Verlag |
Hoofdstuk | 14 |
Pagina's | 301-323 |
Aantal pagina's | 23 |
ISBN van geprinte versie | 978-3-527-33855-9 |
DOI's | |
Status | Gepubliceerd - 8 feb 2019 |