Hybrid Photonic Integration for Optical Switches

Wenjing Tian, Kevin A. Williams, Ronald Dekker, Joost van Kerkhof, Lucas Beste, Xaveer J.M. Leijtens

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Samenvatting

This invited paper reviews the state-of-the-art hybrid photonic integration technologies for optical switches, with a particular emphasis on the advantages of integrating diverse materials, notably indium phosphide and silicon nitride. We highlight progress in various aspects of hybrid photonic integration including achieving high-port-count fiber-chip coupling, facilitating high-density electrical interfaces, and enabling on-chip temperature sensing and control. This paper also provides insights into the potential of hybrid photonic integration in shaping the future of optical switches.
Originele taal-2Engels
Titel2023 International Conference on Photonics in Switching and Computing (PSC)
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's1-3
Aantal pagina's3
ISBN van elektronische versie979-8-3503-2370-2
DOI's
StatusGepubliceerd - 2 nov. 2023
Evenement2023 International Conference on Photonics in Switching and Computing, PSC 2023 - Mantova, Italië
Duur: 26 sep. 202329 sep. 2023

Congres

Congres2023 International Conference on Photonics in Switching and Computing, PSC 2023
Verkorte titelPSC 2023
Land/RegioItalië
StadMantova
Periode26/09/2329/09/23

Financiering

European Union and Microsoft Research are acknowledged for financial support through the Eurostars FLEXFIX program nr.2018.29, Ph.D. Scholarship Programme, and Optics for the Could project.

FinanciersFinanciernummer
Microsoft Research
Eurostars
European Commission

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