High-rate electrochemical copper deposition on bars

The industrial electrodeposition of copper from cupric acid sulphate baths is typically carried out at approximately 3 kA m–2. A much higher rate of copper deposition is necessary to improve this electroplating process significantly. To achieve this higher rate for the deposition of copper on a round bar, the solution flow is directed normal to the axis of a round bar. The current efficiency Cu for copper deposition on a round bar, 9 mm in diameter, has been determined from 1 M H2SO4+1 M CuSO4 bath as a function of current density, solution flow rate and temperature. A set of relations has been proposed for calculating the current efficiency Cu for a broad range of parameters.