Heat sinking of highly integrated photonic and electronic circuits

M.B.J. van Rijn; M.K. Smit; Marc Spiegelberg; S. Paredes

Heat sinking of highly integrated photonic and electronic circuits

M.B.J. van Rijn, M.K. Smit, Marc Spiegelberg, S. Paredes

Photonic Integration

Onderzoeksoutput: Bijdrage aan congres › Abstract › Academic

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Samenvatting

Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

Originele taal-2	Engels
Status	Gepubliceerd - 27 nov 2017
Evenement	22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter - Delft, Nederland Duur: 27 nov 2017 → 28 nov 2017 https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

Congres

Congres	22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter
Land	Nederland
Stad	Delft
Periode	27/11/17 → 28/11/17
Internet adres	https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

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Citeer dit

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title = "Heat sinking of highly integrated photonic and electronic circuits",

abstract = "Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics). ",

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AU - van Rijn, M.B.J.

AU - Smit, M.K.

AU - Spiegelberg, Marc

AU - Paredes, S.

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N2 - Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

AB - Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).

M3 - Abstract

T2 - 22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter

Y2 - 27 November 2017 through 28 November 2017

ER -