Heat sinking of highly integrated photonic and electronic circuits

Onderzoeksoutput: Bijdrage aan congresAbstractAcademic

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Samenvatting

Dense integration of photonic and electronic circuits poses high requirements on thermal management. In this paper we present analysis of temperature distributions in PICs in InP membranes on top of a BiCMOS chip, which contain hot spots in both the photonic and the electronic layer (lasers, optical amplifiers, driver electronics).
Originele taal-2Engels
StatusGepubliceerd - 27 nov 2017
Evenement22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter - Delft, Nederland
Duur: 27 nov 201728 nov 2017
https://www.aanmelder.nl/ipb2017symposium#.Wi6iLnmDO70

Congres

Congres22nd Annual Symposium of the IEEE Photonics Society Benelux Chapter
LandNederland
StadDelft
Periode27/11/1728/11/17
Internet adres

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