Handbook of 3D integration: Volume 4: Design, test, and thermal management

Paul D. Franzon (Redacteur), Erik Jan Marinissen (Redacteur), Muhannad S. Bakir (Redacteur)

Onderzoeksoutput: Boek/rapportBoekredactieAcademic

Samenvatting

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Originele taal-2Engels
Plaats van productieWeinheim
UitgeverijWiley-VCH Verlag
Aantal pagina's470
ISBN van geprinte versie978-3-527-33855-9
DOI's
StatusGepubliceerd - 1 mrt 2019

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