Generic InP-based integration technology : RF crosstalk in High-capacity optical transmitter PICs

W. Yao, G. Gilardi, M.K. Smit, M.J. Wale

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Photonics is a key enabling technology that is used in many areas such as in telecom, datacom or sensing applications. Photonic integrated circuits (PICs), combining several optical components in one chip, are essential for its success but need to be low-cost, mass producible and easily accessible by a broad user range. Generic photonic integration technology can achieve that and is recently gaining increased popularity. The generic foundry approach for photonics follows the same idea as for microelectronics. A small number of basic building blocks (BBs) with basic functions and well-known performances are available and can be monolithically integrated on InP. The user can use them to build more complex circuits that suit their speci¯c needs. The fabrication is performed by a foundry and R&D costs can be reduced using multi-project wafer runs, where designs from di®erent users are collected and realized on the same wafer, so that the total wafer cost is shared by everyone and the entry-cost per user is reduced. Dedicated design kits with component libraries and behavioral models are available and ease the design process for the user and detach him from the actual fabrication process. With this approach, PICs can be brought to many application ¯elds where their full potential can be exploited. One such application ¯eld lies in optical communications, where low-cost high-capacity optical transmitters and receivers are needed for ¯ber-to-the-home or datacenter connections. An opti- cal transmitter consisting of a single wavelength laser and a high-speed modulator can be easily realized in the generic integration technology. Using wavelength division multiplexing (WDM) the channel count can be scaled up to achieve very high transmit capacity on a small PIC. One of several challenges for scaling up the channel count and integration density lies in radiofrequency (RF) crosstalk between modulators. With the help of suitable simulation techniques and mea- surements, RF crosstalk e®ects on the transmitter performance are analyzed. Proper care needs to be taken in the design of both the transmitter PIC and also the electronic package to minimize crosstalk e®ects. The presentation gives an overview of the generic photonic integration technology and its appli- cations in industry and then focuses on RF crosstalk in high-capacity transmitter PICs realized within the generic integration platform.
Originele taal-2Engels
TitelPIERS 2014 Guangzhou : Progress in Electromagnetics Research Symposium : Proceedings, August 25-28, 2014, Guangzhou, China
Pagina's2005-2009
StatusGepubliceerd - 2014
Evenement35th Progress In Electromagnetics Research Symposium (PIERS 2014) - Guangzhou, China
Duur: 25 aug 201428 aug 2014
Congresnummer: 35
http://piers.org/piers2014Guangzhou/

Congres

Congres35th Progress In Electromagnetics Research Symposium (PIERS 2014)
Verkorte titelPIERS 2014
LandChina
StadGuangzhou
Periode25/08/1428/08/14
Internet adres

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    Yao, W., Gilardi, G., Smit, M. K., & Wale, M. J. (2014). Generic InP-based integration technology : RF crosstalk in High-capacity optical transmitter PICs. In PIERS 2014 Guangzhou : Progress in Electromagnetics Research Symposium : Proceedings, August 25-28, 2014, Guangzhou, China (blz. 2005-2009)