TY - GEN
T1 - Full-field identification of interfaces in microelectronic devices
AU - Ruybalid, A.P.
AU - Hoefnagels, J.P.M.
AU - van der Sluis, O.
AU - Geers, M.G.D.
PY - 2017
Y1 - 2017
N2 - To improve the integrity of densely stacked multilayers in microelectronic systems, e.g., Light Emitting Diodes (LED), and thereby overcome the currently experienced problems related to interface failure during manufacturing of such devices, accurate identification of interface properties is essential. The behavior of the interface is only measurable through kinematic information from adjacent materials. The goal of this research is to identify interface parameters by Integrated Digital Image Correlation (IDIC), in which experimental images of a deformation process are correlated by utilizing the mechanical response from finite element (FE) simulations. An interface is herein modeled by cohesive zone (CZ) elements exhibiting constitutive traction-separation laws. The versatility of FE simulations and the kinematic richness of the full-field measurements are thereby exploited. Comprising an elastic hinge system, a small-scale mechanical test-setup is designed from two 3-axes (XYZ) piezo stages, with which micrometer displacements and realistic interface loading conditions (shear, normal, and mixed-mode loading) can be applied to an LED specimen. This allows to, in a well-controlled manner, mechanically mimic interface delamination that is typically induced during fabrication steps by thermal expansion. This setup and the IDIC method are integrated to identify the CZ parameters of the critical interface of an LED specimen.
AB - To improve the integrity of densely stacked multilayers in microelectronic systems, e.g., Light Emitting Diodes (LED), and thereby overcome the currently experienced problems related to interface failure during manufacturing of such devices, accurate identification of interface properties is essential. The behavior of the interface is only measurable through kinematic information from adjacent materials. The goal of this research is to identify interface parameters by Integrated Digital Image Correlation (IDIC), in which experimental images of a deformation process are correlated by utilizing the mechanical response from finite element (FE) simulations. An interface is herein modeled by cohesive zone (CZ) elements exhibiting constitutive traction-separation laws. The versatility of FE simulations and the kinematic richness of the full-field measurements are thereby exploited. Comprising an elastic hinge system, a small-scale mechanical test-setup is designed from two 3-axes (XYZ) piezo stages, with which micrometer displacements and realistic interface loading conditions (shear, normal, and mixed-mode loading) can be applied to an LED specimen. This allows to, in a well-controlled manner, mechanically mimic interface delamination that is typically induced during fabrication steps by thermal expansion. This setup and the IDIC method are integrated to identify the CZ parameters of the critical interface of an LED specimen.
KW - Cohesive zone
KW - Full-field measurement
KW - Interface delamination
KW - Microelectronics
KW - Parameter identification
UR - http://www.scopus.com/inward/record.url?scp=84989337912&partnerID=8YFLogxK
U2 - 10.1007/978-3-319-42228-2_2
DO - 10.1007/978-3-319-42228-2_2
M3 - Conference contribution
AN - SCOPUS:84989337912
SN - 978-3-319-42227-5
T3 - Conference Proceedings of the Society for Experimental Mechanics Series
SP - 9
EP - 13
BT - Micro and Nanomechanics, Volume 5
A2 - Starman, L.V.
A2 - Hay, J.
A2 - Karanjgaokar, N.
PB - Springer
CY - Dordrecht
T2 - 2016 SEM International Congress and Exposition on Experimental and Applied Mechanics
Y2 - 6 June 2016 through 9 June 2016
ER -