Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans; M.I. Kazim; Y. Yu; M.H.A.J. Herben; P.G.M. Baltus; P.F.M. Smulders

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans
, M.I. Kazim
, Y. Yu
, M.H.A.J. Herben
, P.G.M. Baltus
, P.F.M. Smulders

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

9 Citaten (Scopus)

140 Downloads (Pure)

Samenvatting

The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

Originele taal-2	Engels
Titel	3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany
Plaats van productie	Piscataway
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	2818-2822
ISBN van geprinte versie	978-1-4244-4753-4
Status	Gepubliceerd - 2009

Toegang tot document

Metis227443Definitieve gepubliceerde versie, 1,47 MB

Citeer dit

Akkermans, J. A. G., Kazim, M. I., Yu, Y., Herben, M. H. A. J., Baltus, P. G. M., & Smulders, P. F. M. (2009). Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany (blz. 2818-2822). Institute of Electrical and Electronics Engineers.

@inproceedings{580f7863aeb141c388e4539174c95a16,

title = "Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band",

abstract = "The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.",

author = "J.A.G. Akkermans and M.I. Kazim and Y. Yu and M.H.A.J. Herben and P.G.M. Baltus and P.F.M. Smulders",

year = "2009",

language = "English",

isbn = "978-1-4244-4753-4",

pages = "2818--2822",

booktitle = "3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Akkermans, JAG, Kazim, MI, Yu, Y, Herben, MHAJ , Baltus, PGM & Smulders, PFM 2009, Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. in 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Institute of Electrical and Electronics Engineers, Piscataway, blz. 2818-2822.

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. / Akkermans, J.A.G.; Kazim, M.I.; Yu, Y. et al.
3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Piscataway: Institute of Electrical and Electronics Engineers, 2009. blz. 2818-2822.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

AU - Akkermans, J.A.G.

AU - Kazim, M.I.

AU - Yu, Y.

AU - Herben, M.H.A.J.

AU - Baltus, P.G.M.

AU - Smulders, P.F.M.

PY - 2009

Y1 - 2009

N2 - The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

AB - The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.

M3 - Conference contribution

SN - 978-1-4244-4753-4

SP - 2818

EP - 2822

BT - 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

ER -

Akkermans JAG, Kazim MI, Yu Y, Herben MHAJ , Baltus PGM, Smulders PFM. Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany. Piscataway: Institute of Electrical and Electronics Engineers. 2009. blz. 2818-2822

Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

Samenvatting

Toegang tot document

Vingerafdruk

Citeer dit