Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band

J.A.G. Akkermans, M.I. Kazim, Y. Yu, M.H.A.J. Herben, P.G.M. Baltus, P.F.M. Smulders

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

8 Citaten (Scopus)
58 Downloads (Pure)

Samenvatting

The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.
Originele taal-2Engels
Titel3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's2818-2822
ISBN van geprinte versie978-1-4244-4753-4
StatusGepubliceerd - 2009

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  • Citeer dit

    Akkermans, J. A. G., Kazim, M. I., Yu, Y., Herben, M. H. A. J., Baltus, P. G. M., & Smulders, P. F. M. (2009). Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band. In 3rd European Conference on Antennas and Propagation, 2009. EuCAP 2009, 23-27 March 2009, Berlin, Germany (blz. 2818-2822). Institute of Electrical and Electronics Engineers.