Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

J.H.C. Zantvoort, van; S.G.L. Plukker; M.T. Hill; E. Smalbrugge; Erwin Dekkers; G.D. Khoe; A.M.J. Koonen; H. Waardt, de

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

J.H.C. Zantvoort, van, S.G.L. Plukker, M.T. Hill, E. Smalbrugge, Erwin Dekkers, G.D. Khoe, A.M.J. Koonen, H. Waardt, de

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

Samenvatting

A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

Originele taal-2	Engels
Titel	Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium
Redacteuren	P. Mégret, M. Wuilpart, S. Bette, N. Staquet
Plaats van productie	Mons
Uitgeverij	IEEE/LEOS
Pagina's	217-220
ISBN van geprinte versie	2-960022645
Status	Gepubliceerd - 2005
Evenement	10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium - Mons, België Duur: 1 dec. 2005 → 2 dec. 2005

Congres

Congres	10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium
Land/Regio	België
Stad	Mons
Periode	1/12/05 → 2/12/05
Ander	10th Annual Symposium IEEE/LEOS Benelux Chapter, Mons, Belgium

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Zantvoort, van, J. H. C., Plukker, S. G. L., Hill, M. T., Smalbrugge, E., Dekkers, E., Khoe, G. D., Koonen, A. M. J., & Waardt, de, H. (2005). Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. In P. Mégret, M. Wuilpart, S. Bette, & N. Staquet (editors), Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium (blz. 217-220). IEEE/LEOS.

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title = "Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip",

abstract = "A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.",

author = "{Zantvoort, van}, J.H.C. and S.G.L. Plukker and M.T. Hill and E. Smalbrugge and Erwin Dekkers and G.D. Khoe and A.M.J. Koonen and {Waardt, de}, H.",

year = "2005",

language = "English",

isbn = "2-960022645",

pages = "217--220",

editor = "P. M{\'e}gret and M. Wuilpart and S. Bette and N. Staquet",

booktitle = "Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium",

publisher = "IEEE/LEOS",

note = "10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium ; Conference date: 01-12-2005 Through 02-12-2005",

}

Zantvoort, van, JHC, Plukker, SGL, Hill, MT, Smalbrugge, E, Dekkers, E, Khoe, GD , Koonen, AMJ & Waardt, de, H 2005, Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. in P Mégret, M Wuilpart, S Bette & N Staquet (uitgave), Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. IEEE/LEOS, Mons, blz. 217-220, 10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium, Mons, België, 1/12/05.

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. / Zantvoort, van, J.H.C.; Plukker, S.G.L.; Hill, M.T. et al.
Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. uitgave / P. Mégret; M. Wuilpart; S. Bette; N. Staquet. Mons: IEEE/LEOS, 2005. blz. 217-220.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

AU - Zantvoort, van, J.H.C.

AU - Plukker, S.G.L.

AU - Hill, M.T.

AU - Smalbrugge, E.

AU - Dekkers, Erwin

AU - Khoe, G.D.

AU - Koonen, A.M.J.

AU - Waardt, de, H.

PY - 2005

Y1 - 2005

N2 - A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

AB - A mechanical sub-assembly is presented enabling fine positioning and fixation of a lensed 4-fibre array to an integrated two-state AWG-based multiwavelength laser chip. The device operates as an all optical memory element used in optical packet switching and signal processing. The alignment accuracy between fibre array and chip is in the sub-micron range and possible in 4 degrees of freedom. The design minimizes postweld-shifts and enables re-positioning of the fibre array after the first fixation step. The mechanical sub-assembly is mounted in a package with a clamp method to reduce internal stress in the sub-assembly. The chip temperature is varied from 10 *C to 30 *C and stable coupling efficiency is measured.

M3 - Conference contribution

SN - 2-960022645

SP - 217

EP - 220

BT - Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium

A2 - Mégret, P.

A2 - Wuilpart, M.

A2 - Bette, S.

A2 - Staquet, N.

PB - IEEE/LEOS

CY - Mons

T2 - 10th Annual Symposium of the IEEE/LEOS Benelux Chapter, December 1-2, 2005, Mons, Belgium

Y2 - 1 December 2005 through 2 December 2005

ER -

Zantvoort, van JHC, Plukker SGL, Hill MT, Smalbrugge E, Dekkers E, Khoe GD et al. Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip. In Mégret P, Wuilpart M, Bette S, Staquet N, redacteurs, Proceedings of the 10th Annual Symposium IEEE/LEOS Benelux Chapter, 1-2 December 2005, Mons, Belgium. Mons: IEEE/LEOS. 2005. blz. 217-220

Fibre array packaging and pigtailing of an integrated InP-InGaAsP two-state multiwavelength laser chip

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