Fatigue damage modeling in solder interconnections: a cohesive zone approach

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

Originele taal-2	Engels
Titel	EuroSIME, 4th International Conference on thermal and mechanical simulation and experiments in microelectronics and microsystems
Plaats van productie	France, Aix-en-Provence
Pagina's	1-5, On CD-ROM
Status	Gepubliceerd - 2003

Citeer dit

@inproceedings{d7e752c067384a129c70b4b1b3090eef,

title = "Fatigue damage modeling in solder interconnections: a cohesive zone approach",

author = "A.J.J. Abdul-Baqi and P.J.G. Schreurs and M.G.D. Geers",

year = "2003",

language = "English",

pages = "1--5, On CD--ROM",

booktitle = "EuroSIME, 4th International Conference on thermal and mechanical simulation and experiments in microelectronics and microsystems",

}

Fatigue damage modeling in solder interconnections: a cohesive zone approach. / Abdul-Baqi, A.J.J.; Schreurs, P.J.G.; Geers, M.G.D.
EuroSIME, 4th International Conference on thermal and mechanical simulation and experiments in microelectronics and microsystems. France, Aix-en-Provence, 2003. blz. 1-5, On CD-ROM.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Fatigue damage modeling in solder interconnections: a cohesive zone approach

AU - Abdul-Baqi, A.J.J.

AU - Schreurs, P.J.G.

AU - Geers, M.G.D.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SP - 1-5, On CD-ROM

BT - EuroSIME, 4th International Conference on thermal and mechanical simulation and experiments in microelectronics and microsystems

CY - France, Aix-en-Provence

ER -