Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches

B. Munirathinam (Corresponding author), J.P.B. van Dam, A. Herrmann, W.D. van Driel, F. De Buyl, S.J.F. Erich, L.G.J. van der Ven, O.C.G. Adan, J.M.C. Mol (Corresponding author)

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

Uittreksel

In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local corrosion of electronics, which is a major reliability concern for polymer encapsulated LEDs and microelectronics. As the water and corrosive constituents play a crucial role in their reliability, water uptake kinetics, interfacial ion transport and delamination behaviour of silicone coated copper model system, mimicking a typical microelectronics packaging system, is explored in the present work. Electrochemical impedance spectroscopy (EIS) integrated with attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy studies revealed that water diffusion inside the silicone network is Fickian in nature and the evolution of the observed time constants are related to the diffusion and interfacial reactions. A decrease of impedance magnitude with time was observed in EIS measurements concurrently with water absorption bands shifting towards lower wavenumber in ATR-FTIR measurements, implying the growth of strong hydrogen bonding between water molecules and the silicone network. The estimated diffusion constant of water using the capacitance method was in the order of 7 × 10-12 m2 s−1 and the water absorption volume fraction was in the range of 0% to 0.30%. Scanning Kelvin probe studies elucidated the ion transport process occurring at the silicone/copper interface in a humid atmosphere. The interfacial ion transport process is controlled by the interfacial electrochemical reactions at the cathodic delamination front and the estimated average delamination rate is 0.43 mm h-1/2. This work demonstrates that exploring ion and water transport in the silicone coating and along the silicone/copper interface is of pivotal importance as part of a detailed reliability assessment of the polymer encapsulated LEDs and microelectronics.

Originele taal-2Engels
TijdschriftJournal of Materials Science and Technology
DOI's
StatusE-publicatie vóór gedrukte publicatie - 19 sep 2019

Vingerafdruk

Silicones
Copper
Ions
Water
Microelectronics
Delamination
Light emitting diodes
Polymers
Water absorption
Electrochemical impedance spectroscopy
Silicone coatings
Impurities
Caustics
Packaging materials
Surface chemistry
Fourier transform infrared spectroscopy
Absorption spectra
Volume fraction
Hazards
Packaging

Citeer dit

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title = "Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches",
abstract = "In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local corrosion of electronics, which is a major reliability concern for polymer encapsulated LEDs and microelectronics. As the water and corrosive constituents play a crucial role in their reliability, water uptake kinetics, interfacial ion transport and delamination behaviour of silicone coated copper model system, mimicking a typical microelectronics packaging system, is explored in the present work. Electrochemical impedance spectroscopy (EIS) integrated with attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy studies revealed that water diffusion inside the silicone network is Fickian in nature and the evolution of the observed time constants are related to the diffusion and interfacial reactions. A decrease of impedance magnitude with time was observed in EIS measurements concurrently with water absorption bands shifting towards lower wavenumber in ATR-FTIR measurements, implying the growth of strong hydrogen bonding between water molecules and the silicone network. The estimated diffusion constant of water using the capacitance method was in the order of 7 × 10-12 m2 s−1 and the water absorption volume fraction was in the range of 0{\%} to 0.30{\%}. Scanning Kelvin probe studies elucidated the ion transport process occurring at the silicone/copper interface in a humid atmosphere. The interfacial ion transport process is controlled by the interfacial electrochemical reactions at the cathodic delamination front and the estimated average delamination rate is 0.43 mm h-1/2. This work demonstrates that exploring ion and water transport in the silicone coating and along the silicone/copper interface is of pivotal importance as part of a detailed reliability assessment of the polymer encapsulated LEDs and microelectronics.",
keywords = "Delamination, Impedance, Scanning Kelvin probe, Silicone, Water transport",
author = "B. Munirathinam and {van Dam}, J.P.B. and A. Herrmann and {van Driel}, W.D. and {De Buyl}, F. and S.J.F. Erich and {van der Ven}, L.G.J. and O.C.G. Adan and J.M.C. Mol",
year = "2019",
month = "9",
day = "19",
doi = "10.1016/j.jmst.2019.07.044",
language = "English",
journal = "Journal of Materials Science and Technology",
issn = "1005-0302",
publisher = "Elsevier",

}

Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches. / Munirathinam, B. (Corresponding author); van Dam, J.P.B.; Herrmann, A.; van Driel, W.D.; De Buyl, F.; Erich, S.J.F.; van der Ven, L.G.J.; Adan, O.C.G.; Mol, J.M.C. (Corresponding author).

In: Journal of Materials Science and Technology, 19.09.2019.

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

TY - JOUR

T1 - Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemical and Kelvin probe approaches

AU - Munirathinam, B.

AU - van Dam, J.P.B.

AU - Herrmann, A.

AU - van Driel, W.D.

AU - De Buyl, F.

AU - Erich, S.J.F.

AU - van der Ven, L.G.J.

AU - Adan, O.C.G.

AU - Mol, J.M.C.

PY - 2019/9/19

Y1 - 2019/9/19

N2 - In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local corrosion of electronics, which is a major reliability concern for polymer encapsulated LEDs and microelectronics. As the water and corrosive constituents play a crucial role in their reliability, water uptake kinetics, interfacial ion transport and delamination behaviour of silicone coated copper model system, mimicking a typical microelectronics packaging system, is explored in the present work. Electrochemical impedance spectroscopy (EIS) integrated with attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy studies revealed that water diffusion inside the silicone network is Fickian in nature and the evolution of the observed time constants are related to the diffusion and interfacial reactions. A decrease of impedance magnitude with time was observed in EIS measurements concurrently with water absorption bands shifting towards lower wavenumber in ATR-FTIR measurements, implying the growth of strong hydrogen bonding between water molecules and the silicone network. The estimated diffusion constant of water using the capacitance method was in the order of 7 × 10-12 m2 s−1 and the water absorption volume fraction was in the range of 0% to 0.30%. Scanning Kelvin probe studies elucidated the ion transport process occurring at the silicone/copper interface in a humid atmosphere. The interfacial ion transport process is controlled by the interfacial electrochemical reactions at the cathodic delamination front and the estimated average delamination rate is 0.43 mm h-1/2. This work demonstrates that exploring ion and water transport in the silicone coating and along the silicone/copper interface is of pivotal importance as part of a detailed reliability assessment of the polymer encapsulated LEDs and microelectronics.

AB - In general, packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental hazards such as water and ionic contaminants. However, these encapsulants may provide pathways for water and ionic contaminants to reach the metal/polymer interfaces and provoke local corrosion of electronics, which is a major reliability concern for polymer encapsulated LEDs and microelectronics. As the water and corrosive constituents play a crucial role in their reliability, water uptake kinetics, interfacial ion transport and delamination behaviour of silicone coated copper model system, mimicking a typical microelectronics packaging system, is explored in the present work. Electrochemical impedance spectroscopy (EIS) integrated with attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy studies revealed that water diffusion inside the silicone network is Fickian in nature and the evolution of the observed time constants are related to the diffusion and interfacial reactions. A decrease of impedance magnitude with time was observed in EIS measurements concurrently with water absorption bands shifting towards lower wavenumber in ATR-FTIR measurements, implying the growth of strong hydrogen bonding between water molecules and the silicone network. The estimated diffusion constant of water using the capacitance method was in the order of 7 × 10-12 m2 s−1 and the water absorption volume fraction was in the range of 0% to 0.30%. Scanning Kelvin probe studies elucidated the ion transport process occurring at the silicone/copper interface in a humid atmosphere. The interfacial ion transport process is controlled by the interfacial electrochemical reactions at the cathodic delamination front and the estimated average delamination rate is 0.43 mm h-1/2. This work demonstrates that exploring ion and water transport in the silicone coating and along the silicone/copper interface is of pivotal importance as part of a detailed reliability assessment of the polymer encapsulated LEDs and microelectronics.

KW - Delamination

KW - Impedance

KW - Scanning Kelvin probe

KW - Silicone

KW - Water transport

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DO - 10.1016/j.jmst.2019.07.044

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