Samenvatting
The demand for higher quality requires more effective testing to filter out the bad devices. It is already known that multi-detection of single stuck-at faults results in more fortuitous detections of defects not behaving as stuck-at faults, which increases the test quality. Existing multi-detect tests, i.e., the well-known n-detect tests, suffer from significant test size increases. This paper shows that embedding multi-detection of faults within regular ATPG patterns results in a higher quality without a significant increase in test set size. High-volume silicon measurement results demonstrate that embedded multi-detect tests detect 2.3% to 4.7% more defective devices than conventional single-detect stuck-at tests.
| Originele taal-2 | Engels |
|---|---|
| Titel | 2007 IEEE International Test Conference |
| Plaats van productie | Piscataway |
| Uitgeverij | Institute of Electrical and Electronics Engineers |
| Aantal pagina's | 10 |
| ISBN van geprinte versie | 978-1-4244-1127-6 |
| DOI's | |
| Status | Gepubliceerd - 2007 |
| Extern gepubliceerd | Ja |
| Evenement | 10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007) - Acropolis, Nice, Frankrijk Duur: 16 apr. 2007 → 20 apr. 2007 Congresnummer: 10 |
Congres
| Congres | 10th Design, Automation and Test in Europe Conference and Exhibition (DATE 2007) |
|---|---|
| Verkorte titel | DATE 2007 |
| Land/Regio | Frankrijk |
| Stad | Nice |
| Periode | 16/04/07 → 20/04/07 |
| Ander | DATE 2007 |
Vingerafdruk
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