Effect of residual stress on the delamination response of film-substrate systems under bending

P.J.J. Forschelen, A.S.J. Suiker, O. van der Sluis

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

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The effect of residual stress on the delamination behaviour of thin films is examined under four-point bending. Elastic film-substrate systems with and without the addition of a superlayer are analysed by constructing closed-form expressions for the energy release rate at steady-state delamination. The analytical results obtained with these expressions are compared to finite element results based on cohesive zone modelling, showing an excellent
agreement. The closed-form expressions correctly reduce to simpler forms for film-substrate systems without residual stresses, and further include the special case of spontaneous delamination under the presence of a critical residual stress only. The closed-form expression for the elastic film-substrate system without a superlayer is used for indicating errors in alternative analytical expressions presented in the literature. Subsequently, the contribution of substrate plasticity to the delamination resistance is studied by means of
finite element analyses for a range of (relative) film thicknesses and various values of the (relative) interfacial strength. For a compressive residual stress the delamination response typically is characterised by a transition from large scale yielding to small scale yielding under increasing film thickness, while for a tensile residual stress the limit of small scale yielding may not be reached at large film thickness when the interfacial strength is relatively high. Furthermore, stress relaxation induced by large scale yielding diminishes the
influence of the residual stress on the delamination resistance under bending.
Originele taal-2Engels
Pagina's (van-tot)284-299
TijdschriftInternational Journal of Solids and Structures
Volume97-98
DOI's
StatusGepubliceerd - 19 jul 2016

Vingerafdruk

Delamination
Residual Stress
residual stress
Residual stresses
Substrate
Substrates
Film thickness
Closed-form
film thickness
Cohesive Zone
Stress Relaxation
Energy Release Rate
critical loading
Energy release rate
stress relaxation
Stress relaxation
tensile stress
Compressive stress
plastic properties
Tensile stress

Citeer dit

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title = "Effect of residual stress on the delamination response of film-substrate systems under bending",
abstract = "The effect of residual stress on the delamination behaviour of thin films is examined under four-point bending. Elastic film-substrate systems with and without the addition of a superlayer are analysed by constructing closed-form expressions for the energy release rate at steady-state delamination. The analytical results obtained with these expressions are compared to finite element results based on cohesive zone modelling, showing an excellentagreement. The closed-form expressions correctly reduce to simpler forms for film-substrate systems without residual stresses, and further include the special case of spontaneous delamination under the presence of a critical residual stress only. The closed-form expression for the elastic film-substrate system without a superlayer is used for indicating errors in alternative analytical expressions presented in the literature. Subsequently, the contribution of substrate plasticity to the delamination resistance is studied by means offinite element analyses for a range of (relative) film thicknesses and various values of the (relative) interfacial strength. For a compressive residual stress the delamination response typically is characterised by a transition from large scale yielding to small scale yielding under increasing film thickness, while for a tensile residual stress the limit of small scale yielding may not be reached at large film thickness when the interfacial strength is relatively high. Furthermore, stress relaxation induced by large scale yielding diminishes theinfluence of the residual stress on the delamination resistance under bending.",
keywords = "residual stress, thin film delamination, large scale yielding, four-point bending test, cohesive zone modelling",
author = "P.J.J. Forschelen and A.S.J. Suiker and {van der Sluis}, O.",
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Effect of residual stress on the delamination response of film-substrate systems under bending. / Forschelen, P.J.J.; Suiker, A.S.J.; van der Sluis, O.

In: International Journal of Solids and Structures, Vol. 97-98, 19.07.2016, blz. 284-299.

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

TY - JOUR

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AU - Suiker, A.S.J.

AU - van der Sluis, O.

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N2 - The effect of residual stress on the delamination behaviour of thin films is examined under four-point bending. Elastic film-substrate systems with and without the addition of a superlayer are analysed by constructing closed-form expressions for the energy release rate at steady-state delamination. The analytical results obtained with these expressions are compared to finite element results based on cohesive zone modelling, showing an excellentagreement. The closed-form expressions correctly reduce to simpler forms for film-substrate systems without residual stresses, and further include the special case of spontaneous delamination under the presence of a critical residual stress only. The closed-form expression for the elastic film-substrate system without a superlayer is used for indicating errors in alternative analytical expressions presented in the literature. Subsequently, the contribution of substrate plasticity to the delamination resistance is studied by means offinite element analyses for a range of (relative) film thicknesses and various values of the (relative) interfacial strength. For a compressive residual stress the delamination response typically is characterised by a transition from large scale yielding to small scale yielding under increasing film thickness, while for a tensile residual stress the limit of small scale yielding may not be reached at large film thickness when the interfacial strength is relatively high. Furthermore, stress relaxation induced by large scale yielding diminishes theinfluence of the residual stress on the delamination resistance under bending.

AB - The effect of residual stress on the delamination behaviour of thin films is examined under four-point bending. Elastic film-substrate systems with and without the addition of a superlayer are analysed by constructing closed-form expressions for the energy release rate at steady-state delamination. The analytical results obtained with these expressions are compared to finite element results based on cohesive zone modelling, showing an excellentagreement. The closed-form expressions correctly reduce to simpler forms for film-substrate systems without residual stresses, and further include the special case of spontaneous delamination under the presence of a critical residual stress only. The closed-form expression for the elastic film-substrate system without a superlayer is used for indicating errors in alternative analytical expressions presented in the literature. Subsequently, the contribution of substrate plasticity to the delamination resistance is studied by means offinite element analyses for a range of (relative) film thicknesses and various values of the (relative) interfacial strength. For a compressive residual stress the delamination response typically is characterised by a transition from large scale yielding to small scale yielding under increasing film thickness, while for a tensile residual stress the limit of small scale yielding may not be reached at large film thickness when the interfacial strength is relatively high. Furthermore, stress relaxation induced by large scale yielding diminishes theinfluence of the residual stress on the delamination resistance under bending.

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KW - large scale yielding

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