TY - GEN
T1 - Digital image correlation for analyzing portable electronic products during drop impact tests
AU - Scheijgrond, P.L.W.
AU - Shi, D.X.Q.
AU - Driel, van, W.D.
AU - Zhang, G.Q.
AU - Nijmeijer, H.
PY - 2005
Y1 - 2005
N2 - In this paper the feasibility to analyze a guided free fall drop of portable electronic products by
optical inspection using digital image correlation is studied. This technology can examine the product
on every arbitrary place on its surface and allows the product to make guided free fall drops. For this
study, a mobile phone is dropped on a pavement stone under different orientations and heights. The
phone is prepared with a speckle and the impact is recorded by using a high-speed camera. A custom
made program based on digital image correlation is used to calculate the displacement fields during the impact. Out of these results deformations, strains, G-levels, velocities, energy losses, rotations andbending are calculated. Both local and global phenomena are measured and different impact
orientations and heights are examined. The results provide new insights in drop test performance.
AB - In this paper the feasibility to analyze a guided free fall drop of portable electronic products by
optical inspection using digital image correlation is studied. This technology can examine the product
on every arbitrary place on its surface and allows the product to make guided free fall drops. For this
study, a mobile phone is dropped on a pavement stone under different orientations and heights. The
phone is prepared with a speckle and the impact is recorded by using a high-speed camera. A custom
made program based on digital image correlation is used to calculate the displacement fields during the impact. Out of these results deformations, strains, G-levels, velocities, energy losses, rotations andbending are calculated. Both local and global phenomena are measured and different impact
orientations and heights are examined. The results provide new insights in drop test performance.
U2 - 10.1109/ICEPT.2005.1564683
DO - 10.1109/ICEPT.2005.1564683
M3 - Conference contribution
SP - 1
EP - 6
BT - Proceedings of the 6th International Conference on Electronics Packaging Technology 30 august - 2 september 2005, Shenzhen, China
ER -