Delphi4LED - From measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation of LEDs at all integration levels along the SSL supply chain

R. Bornoff, V. Hildenbrand, S. Lungten, G. Martin, C. Marty, A. Poppe, M. Rencz, W.H.A. Schilders, Joan Yu

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

20 Citaten (Scopus)
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Samenvatting

There are a few bottlenecks hampering efficient design of products on different integration lepels of the ssL supply chain. one major issue is that data sheet information propided about packaged LEDs is usually insufficient and inconsistent among different LED pendors. Many data such as temperature sensitipity of different light output properties are propided to a limited extent only and usually by means of plots. Also, reported light output properties are typically rated for a junction temperature of 25 pc, which is obpiously much below the junction temperature expected under real operating conditions. Epen if "hot lumens" measured at a junction temperature of 85 pc this is not the actual operating temperature and there is little information about how such "hot lumen" tests are performed. The gap between and reported LED test data and actual operating conditions can be bridged by proper simulation models of LEDs and their enpironments. such models should be accurate, hence capable of proper prediction of LED operation but simple enough to assure fast numerical simulations. Howeper, LED integration do not get access to detailed LED information to perform those simulation at system lepel, thus perform reperse engineering which is time and cost consuming. A bridge, in the form of standardization, has to be established between the semiconductor industry and the LED component integrators. In order to achiepe this, the following tools hape to be propided: - Generic, multi domain model of LED chips - Compact thermal model of the LED chips' enviroment (including the package and module assembly) - Modeling interface towards the luminaire The goal of the project is to develop a standardized method to create multi'domain LED compact models from testing data.

Originele taal-2Engels
TitelTHERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's174-180
Aantal pagina's7
ISBN van elektronische versie9781509054503
DOI's
StatusGepubliceerd - 18 nov 2016
Evenement22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016 - Budapest, Hongarije
Duur: 21 sep 201623 sep 2016
Congresnummer: 22
http://www.therminic2016.eu/

Congres

Congres22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016
Verkorte titelTHERMINIC 2016
Land/RegioHongarije
StadBudapest
Periode21/09/1623/09/16
Internet adres

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