Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

E.W.C. Coenen; M.A. Matin; W.P. Vellinga; M.G.D. Geers

doi:10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

E.W.C. Coenen, M.A. Matin, W.P. Vellinga, M.G.D. Geers

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

2 Citaten (Scopus)

Samenvatting

Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Originele taal-2	Engels
Titel	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Plaats van productie	Piscataway
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	497-501
Aantal pagina's	5
ISBN van geprinte versie	0-7803-9062-8, 978-0-7803-9062-1
DOI's	https://doi.org/10.1109/ESIME.2005.1502855
Status	Gepubliceerd - 2005
Evenement	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005) - Berlin, Duitsland Duur: 18 apr. 2005 → 20 apr. 2005 Congresnummer: 6

Congres

Congres	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005)
Verkorte titel	EuroSimE 2005
Land/Regio	Duitsland
Stad	Berlin
Periode	18/04/05 → 20/04/05

Toegang tot document

10.1109/ESIME.2005.1502855

Andere bestanden en links

Link to publication in Scopus

Citeer dit

Coenen, E. W. C., Matin, M. A., Vellinga, W. P., & Geers, M. G. D. (2005). Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 (blz. 497-501). Artikel 1502855 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESIME.2005.1502855

Coenen, E.W.C. ; Matin, M.A. ; Vellinga, W.P. et al. / Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway : Institute of Electrical and Electronics Engineers, 2005. blz. 497-501

@inproceedings{db185346b7f5481691442f88227311a5,

title = "Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy",

abstract = "Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.",

author = "E.W.C. Coenen and M.A. Matin and W.P. Vellinga and M.G.D. Geers",

year = "2005",

doi = "10.1109/ESIME.2005.1502855",

language = "English",

isbn = "0-7803-9062-8",

pages = "497--501",

booktitle = "Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005), EuroSimE 2005 ; Conference date: 18-04-2005 Through 20-04-2005",

}

Coenen, EWC, Matin, MA, Vellinga, WP & Geers, MGD 2005, Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. in Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005., 1502855, Institute of Electrical and Electronics Engineers, Piscataway, blz. 497-501, 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005), Berlin, Duitsland, 18/04/05. https://doi.org/10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. / Coenen, E.W.C.; Matin, M.A.; Vellinga, W.P. et al.
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway: Institute of Electrical and Electronics Engineers, 2005. blz. 497-501 1502855.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

AU - Coenen, E.W.C.

AU - Matin, M.A.

AU - Vellinga, W.P.

AU - Geers, M.G.D.

N1 - Conference code: 6

PY - 2005

Y1 - 2005

N2 - Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

AB - Intrinsic thermal fatigue in a mechanically unconstrained Sn-rich Sn-3.8Ag-0.7Cu alloy has been investigated under cyclic thermal loading within the temperature range of 293 K to 353 K. Fatigue damage resulting from this cycling is shown to occur preferentially along some grain boundaries. From a combination of Orientation Imaging Microscopy and Finite Element Modelling it appears that fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

UR - http://www.scopus.com/inward/record.url?scp=33745683865&partnerID=8YFLogxK

U2 - 10.1109/ESIME.2005.1502855

DO - 10.1109/ESIME.2005.1502855

M3 - Conference contribution

AN - SCOPUS:33745683865

SN - 0-7803-9062-8

SN - 978-0-7803-9062-1

SP - 497

EP - 501

BT - Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2005)

Y2 - 18 April 2005 through 20 April 2005

ER -

Coenen EWC, Matin MA, Vellinga WP, Geers MGD. Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. Piscataway: Institute of Electrical and Electronics Engineers. 2005. blz. 497-501. 1502855 doi: 10.1109/ESIME.2005.1502855

Correlation between thermal fatigue and thermal anisotropy in a Sn-rich solder alloy

Samenvatting

Congres

Toegang tot document

Andere bestanden en links

Vingerafdruk

Citeer dit