Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

M.A. Matin; E.W.C. Coenen; W.P. Vellinga; M.G.D. Geers

doi:10.1016/j.scriptamat.2005.06.034

Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers

Onderzoeksoutput: Bijdrage aan tijdschrift › Tijdschriftartikel › Academic › peer review

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Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

Originele taal-2	Engels
Pagina's (van-tot)	927-932
Tijdschrift	Scripta Materialia
Volume	53
Nummer van het tijdschrift	8
DOI's	https://doi.org/10.1016/j.scriptamat.2005.06.034
Status	Gepubliceerd - 2005

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title = "Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy",

abstract = "Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.",

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AU - Coenen, E.W.C.

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AU - Geers, M.G.D.

PY - 2005

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AB - Intrinsic thermal fatigue in a mechanically unconstrained Pb-free, Sn-rich Sn–3.8Ag–0.7Cu alloy has been investigated under cyclic thermal loading between 293 K and 353 K. Fatigue damage is shown to occur preferentially along high angle grain boundaries. From a combination of orientation imaging microscopy and finite element modelling it appears that this fatigue damage and stresses resulting from the thermal anisotropy of Sn are highly correlated.

U2 - 10.1016/j.scriptamat.2005.06.034

DO - 10.1016/j.scriptamat.2005.06.034

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JO - Scripta Materialia

JF - Scripta Materialia

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Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

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