Conformal slip-free wafer chucking using an actuated wafer table

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In semiconductor applications, such as photolithog-raphy and wafer inspection, friction forces and related slip during wafer loading and chucking at the wafer table are known to cause non-reproducible wafer deformations that result in errors between successive processing steps. To minimize these so-called overlay errors, a modified wafer table design is proposed, which can be actuated in various orthogonal low order deformation shapes that are conformal to the shape of the wafer prior to loading. According to the simulation results, the required out of plane deformation for conformal loading can be achieved and the in-plane friction forces can be reduced significantly by matching the neutral plane of the actuated wafer table and the wafer. The actuator print-through effects, however, need further attention.
Originele taal-2Engels
Titel2019 7th International Conference on Control, Mechatronics and Automation (ICCMA)
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's278-282
Aantal pagina's5
ISBN van elektronische versie978-1-7281-3787-2
DOI's
StatusGepubliceerd - 10 feb 2020
Evenement7th International Conference on Control, Mechatronics and Automation (ICCMA) - Delft, Nederland
Duur: 6 nov 20198 nov 2019

Congres

Congres7th International Conference on Control, Mechatronics and Automation (ICCMA)
LandNederland
StadDelft
Periode6/11/198/11/19

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  • Citeer dit

    Hermanussen, S. J., Habets, M. B. I., Heertjes, M. F., & Vermeulen, J. P. M. B. (2020). Conformal slip-free wafer chucking using an actuated wafer table. In 2019 7th International Conference on Control, Mechatronics and Automation (ICCMA) (blz. 278-282). [8988610] Piscataway: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ICCMA46720.2019.8988610