Chip health tracking using dynamic in-situ delay monitoring

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

1 Citaat (Scopus)

Samenvatting

Tracking the gradual effect of silicon aging requires fine-grain slack monitoring. Conventional slack monitoring techniques intend to measure worst-case static slack, i.e. the slack of longest timing path. In sharp contrast to the conventional techniques, we propose a novel technique that is based on dynamic excitation of in-situ delay monitors, i.e. dynamic excitation of the timing paths that are monitored. As the delays degrade, the path delays increase and the monitors are excited more frequently. With the proposed technique, a fine-grained signature of the delay degradation is extracted from the excitation rate of monitors.

Originele taal-2Engels
TitelProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's304-307
Aantal pagina's4
ISBN van elektronische versie9783981926323
DOI's
StatusGepubliceerd - 14 mei 2019
Evenement22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italië
Duur: 25 mrt 201929 mrt 2019

Congres

Congres22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
Verkorte titelDATE2019
LandItalië
StadFlorence
Periode25/03/1929/03/19

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