BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg; Jorn van Engelen; Tjibbe de Vries; Kevin Williams; Jos van der Tol

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

Marc Spiegelberg, Jorn van Engelen, Tjibbe de Vries, Kevin Williams, Jos van der Tol

Photonic Integration

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic

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In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

Originele taal-2	Engels
Titel	Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium
Pagina's	160-163
Aantal pagina's	4
Status	Gepubliceerd - nov. 2018
Evenement	23rd Annual Symposium of the IEEE Photonics Society Benelux - Paleis der Academiën, Brussels, België Duur: 15 nov. 2018 → 16 nov. 2018 Congresnummer: 23

Congres

Congres	23rd Annual Symposium of the IEEE Photonics Society Benelux
Land/Regio	België
Stad	Brussels
Periode	15/11/18 → 16/11/18

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@inproceedings{b2b75568e44e4b7cb9064a643a55d41a,

title = "BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers",

abstract = "In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.",

author = "Marc Spiegelberg and {van Engelen}, Jorn and {de Vries}, Tjibbe and Kevin Williams and {van der Tol}, Jos",

year = "2018",

month = nov,

language = "English",

pages = "160--163",

booktitle = "Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium",

note = "23rd Annual Symposium of the IEEE Photonics Society Benelux ; Conference date: 15-11-2018 Through 16-11-2018",

}

TY - GEN

T1 - BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

AU - Spiegelberg, Marc

AU - van Engelen, Jorn

AU - de Vries, Tjibbe

AU - Williams, Kevin

AU - van der Tol, Jos

N1 - Conference code: 23

PY - 2018/11

Y1 - 2018/11

N2 - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

AB - In this publication the challenges of bonding InP and BiCMOS wafers with high topology are described. A possible process is discussed. Planarization with thick BCB is motivated and the challenges of wafer alignment are explained.

M3 - Conference contribution

SP - 160

EP - 163

BT - Proceedings Symposium IEEE Photonics Society Benelux, 2018, Brussels, Belgium

T2 - 23rd Annual Symposium of the IEEE Photonics Society Benelux

Y2 - 15 November 2018 through 16 November 2018

ER -

BCB bonding of high topology 3 inch InP and BiCMOS wafers for integrated optical transceivers

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Congres

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