Analysis of Etch Depth for Polarization-free Directional Couplers

Ali Emre Kaplan, Jos J.G.M. van der Tol, Paolo Bassi, Gaetano Bellanca

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

We numerically analyze the etch depth as a design parameter for the realization of integrated polarization independent directional couplers. Through finite-element-method simulations, the coupling coefficients of transverse-electric (TE) and transverse-magnetic (TM) polarizations are investigated according to different etch depth levels in the coupling section of the studied device. By optimizing etching depth, the proposed coupler can perform similarly for both polarizations in broadband. According to simulation results, the minimum difference between the TE and TM coupling coefficients can be kept less than 1% in 100 nm of the wavelength range.

Originele taal-2Engels
TitelProceedings of 2020 Italian Conference on Optics and Photonics, ICOP 2020
RedacteurenSilvia Maria Pietralunga, Stefano Selleri
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's4
ISBN van elektronische versie9781728162393
DOI's
StatusGepubliceerd - 25 dec 2020
Evenement2020 Italian Conference on Optics and Photonics, ICOP 2020 - Parma, Italië
Duur: 8 sep 202011 sep 2020

Congres

Congres2020 Italian Conference on Optics and Photonics, ICOP 2020
LandItalië
StadParma
Periode8/09/2011/09/20

Bibliografische nota

Publisher Copyright:
© 2020 IEEE.

Copyright:
Copyright 2021 Elsevier B.V., All rights reserved.

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