Advances in delamination modeling

O. Sluis, van der; C.A. Yuan; W.D. Driel, van; G.Q. Zhang

doi:10.1007/978-0-387-47325-3_4

Advances in delamination modeling

O. Sluis, van der, C.A. Yuan, W.D. Driel, van, G.Q. Zhang

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Hoofdstuk › Academic

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Today’s microelectronic packages are typically composed of various materials, like silicon, metals, oxides, glues, and compounds (polymers). In Fig. 4.1, cross sections of a leadframe- and substrate-based package are depicted. Due to the dissimilar nature of these materials and the inherent presence of a large number of interfaces in each component, various failure modes, such as interface delamination, chip cracking, and/or solder fatigue, will occur during processing (qualification), testing, or usage. The occurring thermomechanically related failures in these components account for more than 65% of the total reliability issues.

Originele taal-2	Engels
Titel	Nanopackaging : nanotechnologies and electronics packaging
Redacteuren	J.E. Morris
Plaats van productie	New York
Uitgeverij	Springer
Pagina's	61-91
ISBN van geprinte versie	978-0-387-47325-3
DOI's	https://doi.org/10.1007/978-0-387-47325-3_4
Status	Gepubliceerd - 2008

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AB - Today’s microelectronic packages are typically composed of various materials, like silicon, metals, oxides, glues, and compounds (polymers). In Fig. 4.1, cross sections of a leadframe- and substrate-based package are depicted. Due to the dissimilar nature of these materials and the inherent presence of a large number of interfaces in each component, various failure modes, such as interface delamination, chip cracking, and/or solder fatigue, will occur during processing (qualification), testing, or usage. The occurring thermomechanically related failures in these components account for more than 65% of the total reliability issues.

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Advances in delamination modeling

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