Advances in delamination modeling

O. Sluis, van der, C.A. Yuan, W.D. Driel, van, G.Q. Zhang

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureHoofdstukAcademic

1 Downloads (Pure)


Today’s microelectronic packages are typically composed of various materials, like silicon, metals, oxides, glues, and compounds (polymers). In Fig. 4.1, cross sections of a leadframe- and substrate-based package are depicted. Due to the dissimilar nature of these materials and the inherent presence of a large number of interfaces in each component, various failure modes, such as interface delamination, chip cracking, and/or solder fatigue, will occur during processing (qualification), testing, or usage. The occurring thermomechanically related failures in these components account for more than 65% of the total reliability issues.
Originele taal-2Engels
TitelNanopackaging : nanotechnologies and electronics packaging
RedacteurenJ.E. Morris
Plaats van productieNew York
ISBN van geprinte versie978-0-387-47325-3
StatusGepubliceerd - 2008


Duik in de onderzoeksthema's van 'Advances in delamination modeling'. Samen vormen ze een unieke vingerafdruk.

Citeer dit