Advanced miniature mixed mode bending setup for in-situ interface delamination characterization

J.P.M. Hoefnagels, N.V.V.R. Murthy Kolluri, M.H.L. Thissen, J.A.W. Dommelen, van, M.G.D. Geers

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A novel test frame configuration was developed and employed to design a new miniature mixed mode bending (MMMB) setup for in-situ characterization of interface delamination in miniature multi-layer structures to accomplish full range of mode mixities. This advanced setup is specially designed with sufficiently small dimensions to fit in a scanning electron microscope and under an optical microscope for detailed real-time fracture analysis during delamination. Analysis of the loads in the new test configuration was performed and a special loading configuration was identified which replicates pure mode II loading better than the conventional end notch flexure (ENF) test. Special care was taken to minimize non-linearities, such as friction, the influence of gravity and geometrical non-linearities. Finite element simulation of the designed setup were performed to show its ability to access all loading modes. Preliminary delamination tests conducted on homogeneous bilayer samples under scanning electron microscope (SEM) proved the new setup configuration is capable of measuring the crack length, crack opening profile and crack delamination mechanism in addition to the conventional energy release rate measurements.
Originele taal-2Engels
TitelProceedings of the 11th International Congress and Exhibition on Experimental and Applied Mechanics, 2-5 June 2008, Orlando, Florida
RedacteurenT. Proulx
Plaats van productieOrlando
UitgeverijSociety for Experimental Mechanics
Pagina's1737-1745
Volume4
ISBN van geprinte versie9781605604152
StatusGepubliceerd - 2008

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Hoefnagels, J. P. M., Murthy Kolluri, N. V. V. R., Thissen, M. H. L., Dommelen, van, J. A. W., & Geers, M. G. D. (2008). Advanced miniature mixed mode bending setup for in-situ interface delamination characterization. In T. Proulx (editor), Proceedings of the 11th International Congress and Exhibition on Experimental and Applied Mechanics, 2-5 June 2008, Orlando, Florida (Vol. 4, blz. 1737-1745). Orlando: Society for Experimental Mechanics.