Active-matrix IGZO array with printed thermistor for large-area thermal imaging

Jan Laurens P.J. van der Steen, Laurens C.J.M. Peters, Edsger C.P. Smits, Peter Zalar, Gerwin H. Gelinck

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Uittreksel

Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

TaalEngels
TitelFLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
Plaats van productiePiscataway
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's3
ISBN van elektronische versie978-1-5386-9304-9
DOI's
StatusGepubliceerd - 1 jul 2019
Evenement1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 - Glasgow, Verenigd Koninkrijk
Duur: 7 jul 201910 jul 2019

Congres

Congres1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019
LandVerenigd Koninkrijk
StadGlasgow
Periode7/07/1910/07/19

Vingerafdruk

Thermistors
thermistors
Infrared imaging
matrices
form factors
costs
meanders
focal plane devices
Image sensors
polyimides
printing
time constant
Hot Temperature
isolation
spatial resolution
capacitance
routes
Focal plane arrays
Screen printing
fabrication

Citeer dit

van der Steen, J. L. P. J., Peters, L. C. J. M., Smits, E. C. P., Zalar, P., & Gelinck, G. H. (2019). Active-matrix IGZO array with printed thermistor for large-area thermal imaging. In FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings [8792229] Piscataway: Institute of Electrical and Electronics Engineers. DOI: 10.1109/FLEPS.2019.8792229
van der Steen, Jan Laurens P.J. ; Peters, Laurens C.J.M. ; Smits, Edsger C.P. ; Zalar, Peter ; Gelinck, Gerwin H./ Active-matrix IGZO array with printed thermistor for large-area thermal imaging. FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway : Institute of Electrical and Electronics Engineers, 2019.
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abstract = "Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.",
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van der Steen, JLPJ, Peters, LCJM, Smits, ECP, Zalar, P & Gelinck, GH 2019, Active-matrix IGZO array with printed thermistor for large-area thermal imaging. in FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings., 8792229, Institute of Electrical and Electronics Engineers, Piscataway, Glasgow, Verenigd Koninkrijk, 7/07/19. DOI: 10.1109/FLEPS.2019.8792229

Active-matrix IGZO array with printed thermistor for large-area thermal imaging. / van der Steen, Jan Laurens P.J.; Peters, Laurens C.J.M.; Smits, Edsger C.P.; Zalar, Peter; Gelinck, Gerwin H.

FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway : Institute of Electrical and Electronics Engineers, 2019. 8792229.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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AU - van der Steen,Jan Laurens P.J.

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AU - Smits,Edsger C.P.

AU - Zalar,Peter

AU - Gelinck,Gerwin H.

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N2 - Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

AB - Thermal imagers conventionally consist of a suspended sensing element on support structure with patterned thermal detection layer to get good thermal isolation between sensor elements[1]. Large area and wearable thermal imaging applications require cost effective fabrication, robustness and a flexible form factor. We present a 16×16 active-matrix IGZO array integrated with a screen printed thermistor on a thin and flexible substrate. Screen printing of the thermistor together with a flat-panel compatible backplane technology provides a cost effective and scalable route to large area thermal imaging. Unlike conventional focal plane arrays and microbolometers, in this work no suspended structures are used. Thus, the challenge is to get sufficient thermal separation between the imager elements, in particular when the thermistor is a single, non-structured layer extending across the entire backplane. The thermal response is determined by the thermal detection layer and the substrate, limiting the thermal response time τ = C/G, with C the thermal capacitance and G the thermal conductance. We show that by integration on thin polyimide film the thermal time constant improves by a factor of 30 compared to the same thermistor array on glass. In addition, we show that the thermal response can be further improved by reducing the thickness of (mainly) the printed thermistor layer. A stretchable form factor can be achieved through the formation of thermistor islands, connected by meander-shaped interconnects, enabling large area thermal imaging on conformal surfaces down to millimeter spatial resolution.

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DO - 10.1109/FLEPS.2019.8792229

M3 - Conference contribution

BT - FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

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van der Steen JLPJ, Peters LCJM, Smits ECP, Zalar P, Gelinck GH. Active-matrix IGZO array with printed thermistor for large-area thermal imaging. In FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. Piscataway: Institute of Electrical and Electronics Engineers. 2019. 8792229. Beschikbaar vanaf, DOI: 10.1109/FLEPS.2019.8792229