A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

3 Citaties (Scopus)
1 Downloads (Pure)

Uittreksel

We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.

Originele taal-2Engels
Titel43rd European Conference on Optical Communication, ECOC 2017
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's3
Volume2017-September
ISBN van elektronische versie978-1-5386-5624-2
DOI's
StatusGepubliceerd - 24 apr 2018
Evenement43rd European Conference on Optical Communications (ECOC 2017) - Gothenburg, Zweden
Duur: 17 sep 201721 sep 2017
Congresnummer: 43
http://ecoc2017.org/
http://ecoc2017.org

Congres

Congres43rd European Conference on Optical Communications (ECOC 2017)
Verkorte titelECOC 2017
LandZweden
StadGothenburg
Periode17/09/1721/09/17
Internet adres

Vingerafdruk

Optical interconnects
Surface emitting lasers
Silicon

Citeer dit

Li, C., Li, T., Stabile, R., & Raz, O. (2018). A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September). [8345902] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECOC.2017.8345902
Li, Chenhui ; Li, Teng ; Stabile, Ripalta ; Raz, Oded. / A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018.
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abstract = "We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.",
author = "Chenhui Li and Teng Li and Ripalta Stabile and Oded Raz",
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Li, C, Li, T, Stabile, R & Raz, O 2018, A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, 8345902, Institute of Electrical and Electronics Engineers, 43rd European Conference on Optical Communications (ECOC 2017), Gothenburg, Zweden, 17/09/17. https://doi.org/10.1109/ECOC.2017.8345902

A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. / Li, Chenhui; Li, Teng; Stabile, Ripalta; Raz, Oded.

43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018. 8345902.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Li C, Li T, Stabile R, Raz O. A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September. Institute of Electrical and Electronics Engineers. 2018. 8345902 https://doi.org/10.1109/ECOC.2017.8345902