A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

3 Citaties (Scopus)

Uittreksel

We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.

TaalEngels
Titel43rd European Conference on Optical Communication, ECOC 2017
UitgeverijInstitute of Electrical and Electronics Engineers
Aantal pagina's3
Volume2017-September
ISBN van elektronische versie978-1-5386-5624-2
DOI's
StatusGepubliceerd - 24 apr 2018
Evenement43rd European Conference on Optical Communications (ECOC 2017) - Gothenburg, Zweden
Duur: 17 sep 201721 sep 2017
Congresnummer: 43
http://ecoc2017.org/
http://ecoc2017.org

Congres

Congres43rd European Conference on Optical Communications (ECOC 2017)
Verkorte titelECOC 2017
LandZweden
StadGothenburg
Periode17/09/1721/09/17
Internet adres

Vingerafdruk

Optical interconnects
Surface emitting lasers
Silicon

Citeer dit

Li, C., Li, T., Stabile, R., & Raz, O. (2018). A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017 (Vol. 2017-September). [8345902] Institute of Electrical and Electronics Engineers. DOI: 10.1109/ECOC.2017.8345902
Li, Chenhui ; Li, Teng ; Stabile, Ripalta ; Raz, Oded. / A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018.
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abstract = "We demonstrate co-integration of 1D arrays of VCSELs into a 2D matrix with a single 48-channel connector. Error-free operation for a sub-group is measured and coupling losses across all 48 VCSELs through the common connector are below 4.6dB.",
author = "Chenhui Li and Teng Li and Ripalta Stabile and Oded Raz",
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Li, C, Li, T, Stabile, R & Raz, O 2018, A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. in 43rd European Conference on Optical Communication, ECOC 2017. vol. 2017-September, 8345902, Institute of Electrical and Electronics Engineers, Gothenburg, Zweden, 17/09/17. DOI: 10.1109/ECOC.2017.8345902

A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. / Li, Chenhui; Li, Teng; Stabile, Ripalta; Raz, Oded.

43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September Institute of Electrical and Electronics Engineers, 2018. 8345902.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Li C, Li T, Stabile R, Raz O. A platform for 2-dimensional 48-channel optical Interconnects based on wet etched silicon interposer. In 43rd European Conference on Optical Communication, ECOC 2017. Vol. 2017-September. Institute of Electrical and Electronics Engineers. 2018. 8345902. Beschikbaar vanaf, DOI: 10.1109/ECOC.2017.8345902