A numerical study of flow boiling in a microchannel using the local front reconstruction method

The rapid advances in performance and miniaturization of electronic devices require a cooling technology that can remove the produced heat at a high rate with small temperature variations, as is obtained in flow boiling. To obtain insight in flow boiling, we performed numerical simulations in a 200 μm square microchannel using the local front reconstruction method. Besides validation with literature results, a parametric study shows an increasing heat removal rate and bubble growth rate with increasing wall temperature, liquid mass density, and liquid heat capacity and decreasing inlet velocity indicating the importance of phase change compared to convective transport. Finally, the heat transfer in the liquid film is studied using a Nusselt number defined with the film thickness, which is comparable to Nusselt number for falling films on hot surfaces. It is observed that convective effects are more pronounced at the bubble rear compared to the bubble front.