A numerical method for efficient failure modelling of three-dimensional bond pad structures

Engineering

• Microelectronics 100%
• End Structure 100%
• Reliability Issue 100%
• Numerical Methods 100%
• Structural Reliability 50%
• Multiscale 50%
• Accurate Prediction 50%
• Two Dimensional 50%
• Energy Release Rate 50%
• Local Scale 50%
• Interfacial Adhesion 50%
• Energy Release 50%
• Local Approach 50%
• Design Complexity 50%
• Bonding Wire 50%
• Pull Test 50%
• Dielectrics 50%
• Bimaterial Interface 50%
• Numerical Model 50%
• Delamination 50%