Samenvatting
A high speed, high density and potentially low cost solution for realizing a compact transceiver module is presented in this paper. It is based on directly bonding an Opto-electronic die on top of CMOS IC chip and creating a photoresist ramp to bridge the big step (around 220µm) from Opto-electronic pads to CMOS IC pads. The required electrical connection between them is realized lithographically with a process than can be scaled to full wafer production. A 12-channel transmitter based on the technique was fabricated and test shows good performance up to 12.5 Gb/s/ch.
Originele taal-2 | Engels |
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Pagina's (van-tot) | B386-B392 |
Tijdschrift | Optics Express |
Volume | 20 |
Nummer van het tijdschrift | 26 |
DOI's | |
Status | Gepubliceerd - 2012 |