A novel 3D stacking approach for chip-to-chip interconnects

P. Duan

Onderzoeksoutput: ScriptieDissertatie 1 (Onderzoek TU/e / Promotie TU/e)

1075 Downloads (Pure)
Originele taal-2Engels
KwalificatieDoctor in de Filosofie
Toekennende instantie
  • Faculteit Electrical Engineering
Begeleider(s)/adviseur
  • Dorren, Harm, Promotor
  • Raz, Oded, Co-Promotor
Datum van toekenning19 nov 2014
Plaats van publicatieEindhoven
Uitgever
Gedrukte ISBN's978-90-386-3718-1
DOI's
StatusGepubliceerd - 19 nov 2014

Bibliografische nota

Proefschrift

Citeer dit

Duan, P. (2014). A novel 3D stacking approach for chip-to-chip interconnects. Eindhoven: Technische Universiteit Eindhoven. https://doi.org/10.6100/IR781403
Duan, P.. / A novel 3D stacking approach for chip-to-chip interconnects. Eindhoven : Technische Universiteit Eindhoven, 2014. 148 blz.
@phdthesis{e2fc28a6d9ac43f4b40ba2e9513e9e63,
title = "A novel 3D stacking approach for chip-to-chip interconnects",
author = "P. Duan",
note = "Proefschrift",
year = "2014",
month = "11",
day = "19",
doi = "10.6100/IR781403",
language = "English",
isbn = "978-90-386-3718-1",
publisher = "Technische Universiteit Eindhoven",
school = "Department of Electrical Engineering",

}

Duan, P 2014, 'A novel 3D stacking approach for chip-to-chip interconnects', Doctor in de Filosofie, Faculteit Electrical Engineering, Eindhoven. https://doi.org/10.6100/IR781403

A novel 3D stacking approach for chip-to-chip interconnects. / Duan, P.

Eindhoven : Technische Universiteit Eindhoven, 2014. 148 blz.

Onderzoeksoutput: ScriptieDissertatie 1 (Onderzoek TU/e / Promotie TU/e)

TY - THES

T1 - A novel 3D stacking approach for chip-to-chip interconnects

AU - Duan, P.

N1 - Proefschrift

PY - 2014/11/19

Y1 - 2014/11/19

U2 - 10.6100/IR781403

DO - 10.6100/IR781403

M3 - Phd Thesis 1 (Research TU/e / Graduation TU/e)

SN - 978-90-386-3718-1

PB - Technische Universiteit Eindhoven

CY - Eindhoven

ER -

Duan P. A novel 3D stacking approach for chip-to-chip interconnects. Eindhoven: Technische Universiteit Eindhoven, 2014. 148 blz. https://doi.org/10.6100/IR781403