A method of heat sink fabrication in InP membrane lasers by bonding on double-layer BCB

Photonic membrane platforms attract a lot of research attention, because they can potentially enable integration of photonic and electronic components on a single chip. In membrane platforms photonic devices are usually separated from the substrate by a thick layer of insulator, so they suffer from inefficient heat sinking. We propose to bond membrane lasers on BCB and tune the bonding layer thickness to reduce the gap between the p-contact of the laser and the substrate, while an extra BCB layer is spun on the Si substrate to improve adhesion and reduce mechanical stress. This method enables direct heat sink from the membrane to the Si substrate on 3-inch wafer scale.