Samenvatting
The purpose of this work is to propose a novel electrothermal co-simulation approach for the new generation of SiC MOSFETs, by development of a PSpice-based compact and physical SiC MOSFET model including temperature dependency of several parameters and a Simulink-based thermal network. The PSpice electrical model is capable to estimate the switching behavior and the energy losses of the device accurately under a wide range of operational conditions, including high temperature operations, within a relatively fast simulation time (few seconds). The the thermal network elements are extracted from the FEM simulation of the DUT's structure, performed in ANSYS Icepack. A MATLAB script is used to process the simulation data and feed the needed settings and parameters back into the simulation. The parameters for a CREE 1.2 kV/30 A SiC MOSFET have been identified and the electro-thermal model has been validated through experimental and manufacturer's data.
Originele taal-2 | Engels |
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Titel | 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) |
Uitgeverij | Institute of Electrical and Electronics Engineers |
Pagina's | 966-973 |
Aantal pagina's | 8 |
ISBN van elektronische versie | 978-1-5090-5366-7 |
DOI's | |
Status | Gepubliceerd - 18 mei 2017 |
Extern gepubliceerd | Ja |
Evenement | 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, Verenigde Staten van Amerika Duur: 26 mrt. 2017 → 30 mrt. 2017 Congresnummer: 32 http://www.apec-conf.org/ |
Congres
Congres | 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 |
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Verkorte titel | APEC 2017 |
Land/Regio | Verenigde Staten van Amerika |
Stad | Tampa |
Periode | 26/03/17 → 30/03/17 |
Internet adres |
Bibliografische nota
Publisher Copyright:© 2017 IEEE.