A fast electro-thermal co-simulation modeling approach for SiC power MOSFETs

Lorenzo Ceccarelli, Amir Sajjad Bahman, Francesco Iannuzzo, Frede Blaabjerg

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

33 Citaten (Scopus)

Samenvatting

The purpose of this work is to propose a novel electrothermal co-simulation approach for the new generation of SiC MOSFETs, by development of a PSpice-based compact and physical SiC MOSFET model including temperature dependency of several parameters and a Simulink-based thermal network. The PSpice electrical model is capable to estimate the switching behavior and the energy losses of the device accurately under a wide range of operational conditions, including high temperature operations, within a relatively fast simulation time (few seconds). The the thermal network elements are extracted from the FEM simulation of the DUT's structure, performed in ANSYS Icepack. A MATLAB script is used to process the simulation data and feed the needed settings and parameters back into the simulation. The parameters for a CREE 1.2 kV/30 A SiC MOSFET have been identified and the electro-thermal model has been validated through experimental and manufacturer's data.

Originele taal-2Engels
Titel2017 IEEE Applied Power Electronics Conference and Exposition (APEC)
UitgeverijInstitute of Electrical and Electronics Engineers
Pagina's966-973
Aantal pagina's8
ISBN van elektronische versie978-1-5090-5366-7
DOI's
StatusGepubliceerd - 18 mei 2017
Extern gepubliceerdJa
Evenement32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, Verenigde Staten van Amerika
Duur: 26 mrt. 201730 mrt. 2017
Congresnummer: 32
http://www.apec-conf.org/

Congres

Congres32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Verkorte titelAPEC 2017
Land/RegioVerenigde Staten van Amerika
StadTampa
Periode26/03/1730/03/17
Internet adres

Bibliografische nota

Publisher Copyright:
© 2017 IEEE.

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