A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

M. de Kok; Paola Escobari Vargas; Elmine Meyer; Friedrich Mueller; Tanja Braun; Ad C.F. Reniers; Ulf Johannsen

doi:10.23919/EuCAP63536.2025.10999199

A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.

Originele taal-2	Engels
Titel	2025 19th European Conference on Antennas and Propagation, EuCAP 2025
Uitgeverij	Institute of Electrical and Electronics Engineers
Aantal pagina's	5
ISBN van elektronische versie	978-88-31299-10-7
DOI's	https://doi.org/10.23919/EuCAP63536.2025.10999199
Status	Gepubliceerd - 21 mei 2025
Evenement	19th European Conference on Antennas and Propagation - Stockholm, Zweden Duur: 30 mrt. 2025 → 4 apr. 2025

Congres

Congres	19th European Conference on Antennas and Propagation
Land/Regio	Zweden
Stad	Stockholm
Periode	30/03/25 → 4/04/25

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This document is a result of the NEXTPERCEPTION project, which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking. Part of the work is co-funded by the PENTAEURIPIDES 2021 project InnoStar. The authors would like to thank Noah Reniers for his help with the measurements.

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10.23919/EuCAP63536.2025.10999199

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de Kok, M., Escobari Vargas, P., Meyer, E., Mueller, F., Braun, T., Reniers, A. C. F., & Johannsen, U. (2025). A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology. In 2025 19th European Conference on Antennas and Propagation, EuCAP 2025 Artikel 10999199 Institute of Electrical and Electronics Engineers. https://doi.org/10.23919/EuCAP63536.2025.10999199

@inproceedings{6d193e44e87d4064bf698fddec57f096,

title = "A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology",

abstract = "This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.",

keywords = "Antenna-in-package, D-band, Differential antenna, Fan-out wafer level package, Reflector-backed dipole",

author = "\{de Kok\}, M. and \{Escobari Vargas\}, Paola and Elmine Meyer and Friedrich Mueller and Tanja Braun and Reniers, \{Ad C.F.\} and Ulf Johannsen",

year = "2025",

month = may,

day = "21",

doi = "10.23919/EuCAP63536.2025.10999199",

language = "English",

booktitle = "2025 19th European Conference on Antennas and Propagation, EuCAP 2025",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "19th European Conference on Antennas and Propagation ; Conference date: 30-03-2025 Through 04-04-2025",

}

de Kok, M , Escobari Vargas, P , Meyer, E, Mueller, F, Braun, T, Reniers, ACF & Johannsen, U 2025, A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology. in 2025 19th European Conference on Antennas and Propagation, EuCAP 2025., 10999199, Institute of Electrical and Electronics Engineers, 19th European Conference on Antennas and Propagation, Stockholm, Zweden, 30/03/25. https://doi.org/10.23919/EuCAP63536.2025.10999199

A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology. / de Kok, M.; Escobari Vargas, Paola ; Meyer, Elmine et al.
2025 19th European Conference on Antennas and Propagation, EuCAP 2025. Institute of Electrical and Electronics Engineers, 2025. 10999199.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

AU - de Kok, M.

AU - Escobari Vargas, Paola

AU - Meyer, Elmine

AU - Mueller, Friedrich

AU - Braun, Tanja

AU - Reniers, Ad C.F.

AU - Johannsen, Ulf

PY - 2025/5/21

Y1 - 2025/5/21

N2 - This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.

AB - This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.

KW - Antenna-in-package

KW - D-band

KW - Differential antenna

KW - Fan-out wafer level package

KW - Reflector-backed dipole

UR - https://www.scopus.com/pages/publications/105007513734

U2 - 10.23919/EuCAP63536.2025.10999199

DO - 10.23919/EuCAP63536.2025.10999199

M3 - Conference contribution

BT - 2025 19th European Conference on Antennas and Propagation, EuCAP 2025

PB - Institute of Electrical and Electronics Engineers

T2 - 19th European Conference on Antennas and Propagation

Y2 - 30 March 2025 through 4 April 2025

ER -

A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

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