A Differential Series-Fed Dipole Array for D-Band Sensing in Wafer Level Package Technology

This paper presents the design and characterization of a series-fed differential Antenna-in-Package (AiP) design, demonstrated as a four- and a six-element reflector-backed linear dipole array, that has been realized in a resin-based fan-out wafer level package technology. The four- and six-element designs achieve −10 dB input reflection bandwidths of 5.5 and 5.9 percent, realized gains of 14 and 15.4 dBi, and side-lobe levels of −10.7 and −12.1 dB, respectively. The realized samples were characterized through probed measurements in a state-of-the-art millimeter-wave anechoic chamber. After taking the RF-probe influence on the antenna performance into consideration, the measurements corroborated the simulated results.