A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging

Xi Zhang; Xiao Liu; Marc Spiegelberg; A. Rainier Van Dommele; Marion K. Matters-Kammerer

doi:10.1109/BCICTS45179.2019.8972717

A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging

Xi Zhang, Xiao Liu, Marc Spiegelberg, A. Rainier Van Dommele, Marion K. Matters-Kammerer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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This paper presents a DC-51.5 GHz PAM-4 dual-channel electro-absorption modulator (EAM) driver realized in a 0.25-μm SiGe:C BiCMOS technology. The EAM driver is designed for 3D wafer scale packaging which integrates silicon electronics IC and InP photonics IC at wafer scale. A new asymmetric-load differential driver topology is proposed to achieve a tunable DC biasing for the EAM without extra off-chip bias-T, which significantly reduces the packaging complexity and cost. Moreover, the driver uses differential outputs to drive a single-ended EAM, which reduces the voltage swing by a factor two and reduces the power consumption. The driver has 9.4 dB gain with a 3 dB bandwidth of 51.5 GHz and -0.2 ~ -2 V tunable output DC biasing range. It delivers a differential output voltage swing of 2 V_ppd at 56 Gb/s PAM-4 and consumes 219 mW per channel, resulting in a figure of merit of 3.9 pJ/bit.

Originele taal-2	Engels
Titel	2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019
Plaats van productie	Piscataway
Uitgeverij	Institute of Electrical and Electronics Engineers
Aantal pagina's	4
ISBN van elektronische versie	9781728105864
DOI's	https://doi.org/10.1109/BCICTS45179.2019.8972717
Status	Gepubliceerd - nov. 2019
Evenement	2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019 - Nashville, Verenigde Staten van Amerika Duur: 3 nov. 2019 → 6 nov. 2019

Congres

Congres	2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019
Land/Regio	Verenigde Staten van Amerika
Stad	Nashville
Periode	3/11/19 → 6/11/19

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Zhang, X., Liu, X., Spiegelberg, M., Van Dommele, A. R., & Matters-Kammerer, M. K. (2019). A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging. In 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019 Artikel 8972717 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/BCICTS45179.2019.8972717

@inproceedings{addb1db16e404c71aa26d47be0c12c86,

title = "A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging",

abstract = "This paper presents a DC-51.5 GHz PAM-4 dual-channel electro-absorption modulator (EAM) driver realized in a 0.25-μm SiGe:C BiCMOS technology. The EAM driver is designed for 3D wafer scale packaging which integrates silicon electronics IC and InP photonics IC at wafer scale. A new asymmetric-load differential driver topology is proposed to achieve a tunable DC biasing for the EAM without extra off-chip bias-T, which significantly reduces the packaging complexity and cost. Moreover, the driver uses differential outputs to drive a single-ended EAM, which reduces the voltage swing by a factor two and reduces the power consumption. The driver has 9.4 dB gain with a 3 dB bandwidth of 51.5 GHz and -0.2 ~ -2 V tunable output DC biasing range. It delivers a differential output voltage swing of 2 Vppd at 56 Gb/s PAM-4 and consumes 219 mW per channel, resulting in a figure of merit of 3.9 pJ/bit.",

author = "Xi Zhang and Xiao Liu and Marc Spiegelberg and {Van Dommele}, {A. Rainier} and Matters-Kammerer, {Marion K.}",

year = "2019",

month = nov,

doi = "10.1109/BCICTS45179.2019.8972717",

language = "English",

booktitle = "2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019 ; Conference date: 03-11-2019 Through 06-11-2019",

}

Zhang, X, Liu, X, Spiegelberg, M , Van Dommele, AR & Matters-Kammerer, MK 2019, A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging. in 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019., 8972717, Institute of Electrical and Electronics Engineers, Piscataway, 2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019, Nashville, Verenigde Staten van Amerika, 3/11/19. https://doi.org/10.1109/BCICTS45179.2019.8972717

A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging. / Zhang, Xi; Liu, Xiao; Spiegelberg, Marc et al.
2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019. Piscataway: Institute of Electrical and Electronics Engineers, 2019. 8972717.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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T1 - A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging

AU - Zhang, Xi

AU - Liu, Xiao

AU - Spiegelberg, Marc

AU - Van Dommele, A. Rainier

AU - Matters-Kammerer, Marion K.

PY - 2019/11

Y1 - 2019/11

N2 - This paper presents a DC-51.5 GHz PAM-4 dual-channel electro-absorption modulator (EAM) driver realized in a 0.25-μm SiGe:C BiCMOS technology. The EAM driver is designed for 3D wafer scale packaging which integrates silicon electronics IC and InP photonics IC at wafer scale. A new asymmetric-load differential driver topology is proposed to achieve a tunable DC biasing for the EAM without extra off-chip bias-T, which significantly reduces the packaging complexity and cost. Moreover, the driver uses differential outputs to drive a single-ended EAM, which reduces the voltage swing by a factor two and reduces the power consumption. The driver has 9.4 dB gain with a 3 dB bandwidth of 51.5 GHz and -0.2 ~ -2 V tunable output DC biasing range. It delivers a differential output voltage swing of 2 Vppd at 56 Gb/s PAM-4 and consumes 219 mW per channel, resulting in a figure of merit of 3.9 pJ/bit.

AB - This paper presents a DC-51.5 GHz PAM-4 dual-channel electro-absorption modulator (EAM) driver realized in a 0.25-μm SiGe:C BiCMOS technology. The EAM driver is designed for 3D wafer scale packaging which integrates silicon electronics IC and InP photonics IC at wafer scale. A new asymmetric-load differential driver topology is proposed to achieve a tunable DC biasing for the EAM without extra off-chip bias-T, which significantly reduces the packaging complexity and cost. Moreover, the driver uses differential outputs to drive a single-ended EAM, which reduces the voltage swing by a factor two and reduces the power consumption. The driver has 9.4 dB gain with a 3 dB bandwidth of 51.5 GHz and -0.2 ~ -2 V tunable output DC biasing range. It delivers a differential output voltage swing of 2 Vppd at 56 Gb/s PAM-4 and consumes 219 mW per channel, resulting in a figure of merit of 3.9 pJ/bit.

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M3 - Conference contribution

BT - 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019

PB - Institute of Electrical and Electronics Engineers

CY - Piscataway

T2 - 2nd IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019

Y2 - 3 November 2019 through 6 November 2019

ER -

Zhang X, Liu X, Spiegelberg M , Van Dommele AR , Matters-Kammerer MK. A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging. In 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, BCICTS 2019. Piscataway: Institute of Electrical and Electronics Engineers. 2019. 8972717 doi: 10.1109/BCICTS45179.2019.8972717

A DC-51.5 GHz electro-absorption modulator driver with tunable differential DC coupling for 3D wafer scale packaging

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