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A 76–81 GHz 2x8 MIMO Radar Transceiver With Broadband Fast Chirp Generation and 16-Antenna-in-Package Virtual Array

  • Zongming Duan
  • , Bowen Wu
  • , Yan Wang
  • , Yun Fang
  • , Yongjie Li
  • , Yanhui Wu
  • , Tao Zhang
  • , Chuanming Zhu
  • , Yuefei Dai
  • , Lei Sang
  • , Hao Gao (Corresponding author)

Onderzoeksoutput: Bijdrage aan tijdschriftTijdschriftartikelAcademicpeer review

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Samenvatting

This article presents a 76–81 GHz millimeter-wave (mm-wave) radar transceiver and a 2 × 8 multi-input multi-output (MIMO) antenna-in-package (AiP) for automotive radar applications. The proposed transceiver chip consists of a frequency-modulated-continuous-wave (FMCW) radar waveform generator, a 3-channel sub-transmitter (Tx), and a 4-channel receiver (Rx) with integrated analog-to-digital converters (ADC). A two-point modulation scheme and a digital-to-analog converter’s (DAC) dynamic bias technique are adopted in the FMCW generator to achieve fast chirps and broad modulation bandwidth. A maximum modulation bandwidth of 7.2 GHz is measured. A measured maximum chirp rate reaches 312 MHz/ μ s while the rms linearity stays less than 0.32%. The measured best-case chirp linearity peak error is 0.018% when the chirp rate is set as 9.21 MHz/ μ s. Two transceiver chips operating in a primary-secondary mode, 2 Tx antennas, and 8 Rx antennas are packaged in the embedded glass fan-out (eGFO) technology for better detection capability. Each Tx patch antenna is fed by three power amplifier (PA) outputs through a coaxial feeding structure. The measured Tx effective isotropic radiated power (EIRP) is improved by 7.5 dB compared to a single-feed antenna. Therefore, the chipset demo shows a detection range of up to 38.5 m. The transceiver chip is fabricated in a 65 nm CMOS technology and occupies 5.8 × 5.8 mm 2 . The packaged 2 × 8 MIMO AiP chipset is 24 × 24 mm 2 .
Originele taal-2Engels
Artikelnummer10130816
Pagina's (van-tot)3103-3112
Aantal pagina's10
TijdschriftIEEE Journal of Solid-State Circuits
Volume58
Nummer van het tijdschrift11
DOI's
StatusGepubliceerd - nov 2023

Financiering

The authors would like to thank Daquan Yu of Sky Semiconductor, Irvine, CA, USA, for package fabrication, Yan Wang of Tsinghua University, Beijing, China, for mm-wave design support, and all the other members contributing to this work, including Wei Peng, Weiwei Jin, Peng Chen, Daiguo Xu, Xiaofang Jin, and Lingrui Huang.

Financiers
Tsinghua University, Beijing

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