A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

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This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

Originele taal-2Engels
Titel2018 18th Mediterranean Microwave Symposium, MMS 2018
UitgeverijIEEE Computer Society
Aantal pagina's4
ISBN van elektronische versie9781538671320
StatusGepubliceerd - 14 jan 2019
Evenement18th Mediterranean Microwave Symposium, MMS 2018 - Istanbul, Turkije
Duur: 31 okt 20182 nov 2018


Congres18th Mediterranean Microwave Symposium, MMS 2018


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