A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang; Xiao Liu; Marc Spiegelberg; Arezou Meighan; Jos J.G.M. van der Tol; Marion K. Matters-Kammerer

doi:10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang, Xiao Liu, Marc Spiegelberg, Arezou Meighan, Jos J.G.M. van der Tol, Marion K. Matters-Kammerer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

1 Citaat (Scopus)

6 Downloads (Pure)

Samenvatting

This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

Originele taal-2	Engels
Titel	2018 18th Mediterranean Microwave Symposium, MMS 2018
Uitgeverij	IEEE Computer Society
Pagina's	112-115
Aantal pagina's	4
ISBN van elektronische versie	9781538671320
DOI's	https://doi.org/10.1109/MMS.2018.8611895
Status	Gepubliceerd - 14 jan 2019
Evenement	18th Mediterranean Microwave Symposium, MMS 2018 - Istanbul, Turkije Duur: 31 okt 2018 → 2 nov 2018

Congres

Congres	18th Mediterranean Microwave Symposium, MMS 2018
Land	Turkije
Stad	Istanbul
Periode	31/10/18 → 2/11/18

Toegang tot document

10.1109/MMS.2018.8611895

Link to publication in Scopus

Vingerafdruk Duik in de onderzoeksthema's van 'A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging'. Samen vormen ze een unieke vingerafdruk.

Citeer dit

@inproceedings{5dd0749d30154c568440ce62d8b890b6,

title = "A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging",

abstract = "This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.",

keywords = "Driver circuits, Optical driver IC, PAM-4, Through-polymer via, Wafer Scale integration",

author = "Xi Zhang and Xiao Liu and Marc Spiegelberg and Arezou Meighan and {van der Tol}, {Jos J.G.M.} and Matters-Kammerer, {Marion K.}",

year = "2019",

month = jan,

day = "14",

doi = "10.1109/MMS.2018.8611895",

language = "English",

pages = "112--115",

booktitle = "2018 18th Mediterranean Microwave Symposium, MMS 2018",

publisher = "IEEE Computer Society",

address = "United States",

note = "18th Mediterranean Microwave Symposium, MMS 2018 ; Conference date: 31-10-2018 Through 02-11-2018",

}

Zhang, X, Liu, X , Spiegelberg, M , Meighan, A , van der Tol, JJGM & Matters-Kammerer, MK 2019, A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. in 2018 18th Mediterranean Microwave Symposium, MMS 2018., 8611895, IEEE Computer Society, blz. 112-115, 18th Mediterranean Microwave Symposium, MMS 2018, Istanbul, Turkije, 31/10/18. https://doi.org/10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. / Zhang, Xi; Liu, Xiao ; Spiegelberg, Marc ; Meighan, Arezou ; van der Tol, Jos J.G.M.; Matters-Kammerer, Marion K.

2018 18th Mediterranean Microwave Symposium, MMS 2018. IEEE Computer Society, 2019. blz. 112-115 8611895.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

AU - Zhang, Xi

AU - Liu, Xiao

AU - Spiegelberg, Marc

AU - Meighan, Arezou

AU - van der Tol, Jos J.G.M.

AU - Matters-Kammerer, Marion K.

PY - 2019/1/14

Y1 - 2019/1/14

N2 - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

AB - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

KW - Driver circuits

KW - Optical driver IC

KW - PAM-4

KW - Through-polymer via

KW - Wafer Scale integration

UR - http://www.scopus.com/inward/record.url?scp=85061815433&partnerID=8YFLogxK

U2 - 10.1109/MMS.2018.8611895

DO - 10.1109/MMS.2018.8611895

M3 - Conference contribution

AN - SCOPUS:85061815433

SP - 112

EP - 115

BT - 2018 18th Mediterranean Microwave Symposium, MMS 2018

PB - IEEE Computer Society

T2 - 18th Mediterranean Microwave Symposium, MMS 2018

Y2 - 31 October 2018 through 2 November 2018

ER -