A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang; Xiao Liu; Marc Spiegelberg; Arezou Meighan; Jos J.G.M. van der Tol; Marion K. Matters-Kammerer

doi:10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

Xi Zhang, Xiao Liu, Marc Spiegelberg, Arezou Meighan, Jos J.G.M. van der Tol, Marion K. Matters-Kammerer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

Originele taal-2	Engels
Titel	2018 18th Mediterranean Microwave Symposium, MMS 2018
Uitgeverij	IEEE Computer Society
Pagina's	112-115
Aantal pagina's	4
ISBN van elektronische versie	9781538671320
DOI's	https://doi.org/10.1109/MMS.2018.8611895
Status	Gepubliceerd - 14 jan. 2019
Evenement	18th Mediterranean Microwave Symposium, MMS 2018 - Istanbul, Turkije Duur: 31 okt. 2018 → 2 nov. 2018

Congres

Congres	18th Mediterranean Microwave Symposium, MMS 2018
Land/Regio	Turkije
Stad	Istanbul
Periode	31/10/18 → 2/11/18

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@inproceedings{5dd0749d30154c568440ce62d8b890b6,

title = "A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging",

abstract = "This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.",

keywords = "Driver circuits, Optical driver IC, PAM-4, Through-polymer via, Wafer Scale integration",

author = "Xi Zhang and Xiao Liu and Marc Spiegelberg and Arezou Meighan and {van der Tol}, {Jos J.G.M.} and Matters-Kammerer, {Marion K.}",

year = "2019",

month = jan,

day = "14",

doi = "10.1109/MMS.2018.8611895",

language = "English",

pages = "112--115",

booktitle = "2018 18th Mediterranean Microwave Symposium, MMS 2018",

publisher = "IEEE Computer Society",

address = "United States",

note = "18th Mediterranean Microwave Symposium, MMS 2018 ; Conference date: 31-10-2018 Through 02-11-2018",

}

Zhang, X, Liu, X, Spiegelberg, M, Meighan, A, van der Tol, JJGM & Matters-Kammerer, MK 2019, A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. in 2018 18th Mediterranean Microwave Symposium, MMS 2018., 8611895, IEEE Computer Society, blz. 112-115, 18th Mediterranean Microwave Symposium, MMS 2018, Istanbul, Turkije, 31/10/18. https://doi.org/10.1109/MMS.2018.8611895

A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging. / Zhang, Xi; Liu, Xiao; Spiegelberg, Marc; Meighan, Arezou; van der Tol, Jos J.G.M.; Matters-Kammerer, Marion K.

2018 18th Mediterranean Microwave Symposium, MMS 2018. IEEE Computer Society, 2019. blz. 112-115 8611895.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

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N2 - This paper presents the design and measurement of a 50 Gb/s PAM-4 optical modulator driver in a 0.25 μ m SiGe:C BiCMOS process and analyzes the RF performance of a new photonic-electronic wafer scale packaging technology and its impact on the eye diagram of the driver. In the new wafer scale packaging technology 7 μ m through polymer vias are created to connect an InP photonic wafer to a Silicon electronic wafer. The new through polymer vias with their small size, high density, low parasitics and strong mechanic reliability are suitable for high data rate optical communication up to 130 GBaud. A linear optical modulator driver has been designed and fabricated. It has 15 dB of gain with a 3 dB bandwidth of 24 GHz, delivers 3.2 V differentially at 50 Gb/s PAM-4 and consumes 400 mW, resulting in a figure of merit of 8 pJ/bit.

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A 50 Gb/s PAM-4 optical modulator driver for 3D photonic electronic wafer scale packaging

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