A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging

Xiao Liu; Xi Zhang; Domine Leenaerts; Marion K. Matters-Kammerer

doi:10.1109/ISCAS45731.2020.9180884

A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging

Xiao Liu
, Xi Zhang
, Domine Leenaerts
, Marion K. Matters-Kammerer

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

2 Citaten (Scopus)

Samenvatting

This paper presents a new DC-coupled differential driver for 3D photonic electronic wafer-scale packaging. The DC-coupling between the driver's output and a Mach-Zehnder modulator (MZM), overcomes the limitations of on-chip bias-Ts and achieves wideband RF performance. For the biasing and impedance matching it uses off-chip inductors as RF chokes and two on-chip 50 Ω resistors in series with a capacitor as the driver's differential termination. The proposed driver has independent voltage supplies for the differential branches, and each branch can be tuned between 4 V and 6 V separately to account for different modulations format and fabrication tolerance of MZMs. The designed distributed driver is realized in a 0.25 µm SiGe:C BiCMOS technology, and shows a 3-dB bandwidth of 50 GHz, 100 Gb/s PAM4 eye diagram and state-of-the-art 6.3 pJ/bit power efficiency in post-layout simulation.

Originele taal-2	Engels
Titel	2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings
Uitgeverij	Institute of Electrical and Electronics Engineers
Pagina's	1-5
Aantal pagina's	5
ISBN van elektronische versie	9781728133201
DOI's	https://doi.org/10.1109/ISCAS45731.2020.9180884
Status	Gepubliceerd - 2020
Evenement	52nd IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Virtual, Online, Sevilla, Spanje Duur: 10 okt 2020 → 21 okt 2020

Congres

Congres	52nd IEEE International Symposium on Circuits and Systems, ISCAS 2020
Land/Regio	Spanje
Stad	Sevilla
Periode	10/10/20 → 21/10/20

Bibliografische nota

Funding Information:
This work has received funding from the HTSM Photronics project, supported by the Dutch Technology Foundation NWO.

Financiering

This work has received funding from the HTSM Photronics project, supported by the Dutch Technology Foundation NWO.

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10.1109/ISCAS45731.2020.9180884

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Citeer dit

Liu, X., Zhang, X., Leenaerts, D., & Matters-Kammerer, M. K. (2020). A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging. In 2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings (blz. 1-5). Artikel 9180884 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ISCAS45731.2020.9180884

@inproceedings{bdb92013bc9c4ce7862b84aee5316eaf,

title = "A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging",

abstract = "This paper presents a new DC-coupled differential driver for 3D photonic electronic wafer-scale packaging. The DC-coupling between the driver's output and a Mach-Zehnder modulator (MZM), overcomes the limitations of on-chip bias-Ts and achieves wideband RF performance. For the biasing and impedance matching it uses off-chip inductors as RF chokes and two on-chip 50 Ω resistors in series with a capacitor as the driver's differential termination. The proposed driver has independent voltage supplies for the differential branches, and each branch can be tuned between 4 V and 6 V separately to account for different modulations format and fabrication tolerance of MZMs. The designed distributed driver is realized in a 0.25 µm SiGe:C BiCMOS technology, and shows a 3-dB bandwidth of 50 GHz, 100 Gb/s PAM4 eye diagram and state-of-the-art 6.3 pJ/bit power efficiency in post-layout simulation.",

keywords = "DC-coupled, Distributed amplifiers, Mach-Zehnder modulator (MZM), Modulator driver, SiGe BiCMOS",

author = "Xiao Liu and Xi Zhang and Domine Leenaerts and Matters-Kammerer, \{Marion K.\}",

note = "Funding Information: This work has received funding from the HTSM Photronics project, supported by the Dutch Technology Foundation NWO. ; 52nd IEEE International Symposium on Circuits and Systems, ISCAS 2020 ; Conference date: 10-10-2020 Through 21-10-2020",

year = "2020",

doi = "10.1109/ISCAS45731.2020.9180884",

language = "English",

pages = "1--5",

booktitle = "2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

}

Liu, X, Zhang, X, Leenaerts, D & Matters-Kammerer, MK 2020, A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging. in 2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings., 9180884, Institute of Electrical and Electronics Engineers, blz. 1-5, 52nd IEEE International Symposium on Circuits and Systems, ISCAS 2020, Sevilla, Spanje, 10/10/20. https://doi.org/10.1109/ISCAS45731.2020.9180884

A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging. / Liu, Xiao; Zhang, Xi; Leenaerts, Domine et al.
2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings. Institute of Electrical and Electronics Engineers, 2020. blz. 1-5 9180884.

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/Congresprocedure › Conferentiebijdrage › Academic › peer review

TY - GEN

T1 - A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging

AU - Liu, Xiao

AU - Zhang, Xi

AU - Leenaerts, Domine

AU - Matters-Kammerer, Marion K.

N1 - Funding Information: This work has received funding from the HTSM Photronics project, supported by the Dutch Technology Foundation NWO.

PY - 2020

Y1 - 2020

N2 - This paper presents a new DC-coupled differential driver for 3D photonic electronic wafer-scale packaging. The DC-coupling between the driver's output and a Mach-Zehnder modulator (MZM), overcomes the limitations of on-chip bias-Ts and achieves wideband RF performance. For the biasing and impedance matching it uses off-chip inductors as RF chokes and two on-chip 50 Ω resistors in series with a capacitor as the driver's differential termination. The proposed driver has independent voltage supplies for the differential branches, and each branch can be tuned between 4 V and 6 V separately to account for different modulations format and fabrication tolerance of MZMs. The designed distributed driver is realized in a 0.25 µm SiGe:C BiCMOS technology, and shows a 3-dB bandwidth of 50 GHz, 100 Gb/s PAM4 eye diagram and state-of-the-art 6.3 pJ/bit power efficiency in post-layout simulation.

AB - This paper presents a new DC-coupled differential driver for 3D photonic electronic wafer-scale packaging. The DC-coupling between the driver's output and a Mach-Zehnder modulator (MZM), overcomes the limitations of on-chip bias-Ts and achieves wideband RF performance. For the biasing and impedance matching it uses off-chip inductors as RF chokes and two on-chip 50 Ω resistors in series with a capacitor as the driver's differential termination. The proposed driver has independent voltage supplies for the differential branches, and each branch can be tuned between 4 V and 6 V separately to account for different modulations format and fabrication tolerance of MZMs. The designed distributed driver is realized in a 0.25 µm SiGe:C BiCMOS technology, and shows a 3-dB bandwidth of 50 GHz, 100 Gb/s PAM4 eye diagram and state-of-the-art 6.3 pJ/bit power efficiency in post-layout simulation.

KW - DC-coupled

KW - Distributed amplifiers

KW - Mach-Zehnder modulator (MZM)

KW - Modulator driver

KW - SiGe BiCMOS

UR - https://www.scopus.com/pages/publications/85101040284

U2 - 10.1109/ISCAS45731.2020.9180884

DO - 10.1109/ISCAS45731.2020.9180884

M3 - Conference contribution

AN - SCOPUS:85101040284

SP - 1

EP - 5

BT - 2020 IEEE International Symposium on Circuits and Systems, ISCAS 2020 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 52nd IEEE International Symposium on Circuits and Systems, ISCAS 2020

Y2 - 10 October 2020 through 21 October 2020

ER -

A 100 Gb/s DC-coupled optical modulator driver for 3D photonic electronic wafer-scale packaging

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Congres

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