56 Gb/s PAM-4 optical modulator driver for 3D wafer scale packaging

Onderzoeksoutput: Bijdrage aan congresPoster

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Samenvatting

In this poster, an optical modulator driver which is designed for electronic and photonic wafer scale packaging is presented. By using the polymer adhesive bonding technique, Silicon Electronic
Integrated Circuits (EICs) bond to the InP Photonic Integrated circuits (PICs) on the wafer scale. Small through polymer vias (TPVs) connect EICs to the PICs which reduces the parasitics and improves the maximum date rate. The presented optical modulator driver is designed for wafer scale packaging which optimizes the interface between PIC and EIC, result in a power efficient and high speed circuit. Moreover, the driver output provides a DC voltage bias for  the optical modulator without using a bias-T. The driver is measured with 3 dB bandwidth of 31.5 GHz and a data rate of 56 Gb/s PAM-4 with 3 Vpp output voltage swing 
Originele taal-2Engels
StatusGepubliceerd - 8 jun 2018
Evenement2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018) - Bram Nauta, University of Twente, Enschede, Nederland
Duur: 7 jun 20188 jun 2018
https://prorisc2018.eu/

Congres

Congres2018 Annual Workshop on Circuits, Systems and Signal Processing (ProRISC 2018)
Verkorte titelProRISC 2018
LandNederland
StadEnschede
Periode7/06/188/06/18
Internet adres

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