3D stacked transmitter and receiver chips for high bandwidth density optical interconnects

P. Duan, O. Raz, B.E. Smalbrugge, K.L. Plassche, van de, S. Dorrestein, J. Duis, H.J.S. Dorren

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

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Samenvatting

A receiver chip based on 3D stacking a photodiode chip directly on top of TIA CMOS IC is demonstrated. Open eye patterns are demonstrated for both 3D stacked receiver and transmitter chips and BER measurements of the transmitter show penalty free operation under uniform biasing conditions proving that the interconnecting technology is robust.
Originele taal-2Engels
TitelECOC 2013 : 39th European Conference and Exhibition on Optical Communication, September 22-26, 2013, London, United Kingdom
StatusGepubliceerd - 2013

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  • Citeer dit

    Duan, P., Raz, O., Smalbrugge, B. E., Plassche, van de, K. L., Dorrestein, S., Duis, J., & Dorren, H. J. S. (2013). 3D stacked transmitter and receiver chips for high bandwidth density optical interconnects. In ECOC 2013 : 39th European Conference and Exhibition on Optical Communication, September 22-26, 2013, London, United Kingdom