3Dμtune: hHigh-Q micromachined cavities for millimetre-wave filters and oscillators

J. B. Mills, B. Giesbers, M. Matters-Kammerer, I. Ocket, B. Nauwelaers, A. Jourdain, W. Gautier, B. Schönlinner

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

An analysis of the translation of RF frequency precision specifications into thin-film processing technology requirements for high Q-factor Silicon cavity resonators is presented. Two alternative methods of coupling RF power into-and out-of Silicon cavity resonators using existing high-Ohmic Silicon passive integration platforms from IMEC (MCM-D) and NXP (PASSI) are discussed.

Originele taal-2Engels
Titel16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
Pagina's625-629
Aantal pagina's5
StatusGepubliceerd - 1 dec 2007
Extern gepubliceerdJa
Evenement16th European Microelectronics and Packaging Conference and Exhibition 2007 (EMPC 2007) - Oulu, Finland
Duur: 17 jun 200720 jun 2007

Congres

Congres16th European Microelectronics and Packaging Conference and Exhibition 2007 (EMPC 2007)
LandFinland
StadOulu
Periode17/06/0720/06/07

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  • Citeer dit

    Mills, J. B., Giesbers, B., Matters-Kammerer, M., Ocket, I., Nauwelaers, B., Jourdain, A., ... Schönlinner, B. (2007). 3Dμtune: hHigh-Q micromachined cavities for millimetre-wave filters and oscillators. In 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 (blz. 625-629)