36 Gb/s operation of a BICMOS driver and INP EAM using foundry platforms

Marija Trajkovic, Xi Zhang, Fabrice Blache, Karim Mekhazni, Marion K. Matters-Kammerer, Helene Debregeas, Xaveer J.M. Leijtens, Kevin A. Williams

Onderzoeksoutput: Hoofdstuk in Boek/Rapport/CongresprocedureConferentiebijdrageAcademicpeer review

Samenvatting

We demonstrate a clear eye-diagram at 36 Gb/s of a BiCMOS driver directly wire-bonded to an InP electro-absorption modulator (EAM) both fabricated through foundry platforms. The driver is fabricated in a 0.25 µm SiGe:C BiCMOS technology and delivers a maximum of 2 Vp-p amplitude when single-ended. The driver is DC-coupled to the modulator, simplifying the electronic-photonic assembly. The EAM operates in the L-band at 1590 nm, with a DC bias set at -1.6 V for on-off keying nonreturn to zero modulation. We measure the operation from 10 to 40 Gb/s, recording the dynamic extinction ratio from 5 to 3 dB, respectively. The use of foundry platforms does not require any fabrication process change and offers a wide spectrum of high-performance photonic-electronic integrated circuits.

Originele taal-2Engels
Titel45th European Conference on Optical Communication (ECOC 2019)
UitgeverijInstitution of Engineering and Technology (IET)
Pagina's1-3
Aantal pagina's3
Volume1
ISBN van geprinte versie978-1-83953-185-9
DOI's
StatusGepubliceerd - 30 jun. 2020
Evenement45th European Conference on Optical Communication, ECOC 2019 - Dublin, Ierland
Duur: 22 sep. 201926 sep. 2019

Publicatie series

NaamIET Conference Publications
VolumeCP765

Congres

Congres45th European Conference on Optical Communication, ECOC 2019
Land/RegioIerland
StadDublin
Periode22/09/1926/09/19

Bibliografische nota

Funding Information:
The first two authors contributed equally to the presented work. The authors would like to thank the European Commission for funding this research through projects FP7-PEOPLE under grant agreement no 317316, the H2020 project WIPE under grant agreement no 688572, and the Dutch Stimulus OPZuid programme through the Open Innovation Photonic ICs project (PROJ-00315).

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