Reliability assessment of conductive adhesive bonds by humidity and temperature tests is time consuming and does not provide enough information about the details of the onset of degradation. There is a need for measurements that can give an early warning about the contact quality with more quantitative details about its degradation. Here 1/f noise of such contact arrays is investigated before and after temperature and humidity stress tests with different durations. 1/f Noise stems from conductance fluctuations. We investigated the constriction resistance 1/f noise SR of the contact constriction resistance RC before accelerated aging and during aging at temperatures of 85°C and 110°C with an 85% relative humidity. Noise analysis on non-degraded samples is also a fast diagnostic tool for reliability characterization. From the analysis based on a noise model for a multispot contact, the onset of constriction resistance increase goes hand in hand with a strong increase in resistance noise. This is understood and can be characterized by a reduction in the electrical contact area Ae. The degree of contact degradation is expressed in a reduction of the real electrical contact area Ae of a multispot contact and is quantitatively given by the D-factor.