Best 3D Track Paper at International Wafer-Level Packaging Conference 2018

  • Arnita Podpod (Ontvanger), Dimitrios Velenis (Ontvanger), Alain Phommahaxay (Ontvanger), Pieter Bex (Ontvanger), Ferenc Fodor (Ontvanger), Marinissen, Erik Jan (Ontvanger), Kenneth June Rebibis (Ontvanger), Andy Miller (Ontvanger), Gerald Beyer (Ontvanger) & Eric Beyne (Ontvanger)

Prijs: AndersWerk, activiteit of publicatie gerelateerde prijzen (lifetime, best paper, poster etc.)Wetenschappelijk

Omschrijving

Arnita Podpod, Dimitrios Velenis, Alain Phommahaxay, Pieter Bex, Ferenc Fodor, Erik Jan Marinissen, Kenneth June Rebibis, Andy Miller, Gerald Beyer, and Eric Beyne, 'High Density and High Bandwidth Chip-to-Chip Connections with 20µm Pitch Flip-Chip on Fan-Out Wafer Level Package', International Wafer-Level Packaging Conference (IWLPC'18), San Jose, CA, USA, October 2018, doi: http://doi.org/10.23919/IWLPC.2018.8573262
Mate van erkenningInternationaal
OrganisatiesInternational Wafer-Level Packaging Conference (IWLPC)

Werk, activiteit of publicatie gerelateerde prijzen (lifetime, best paper, poster etc.)

Toegekend op evenementInternational Wafer-Level Packaging Conference
LocationDoubletree Hotel by Hilton San Jose, San Jose, CA, Verenigde Staten van Amerika
Periode23 okt 2018 → 25 okt 2018

    Vingerafdruk