WIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)

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Periode5 nov 2018

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  • TitelWIPO PUBLISHES PATENT OF TECHNISCHE UNIVERSITEIT EINDHOVEN FOR "COMBINED 3D ASSEMBLY OF ASIC AND OPTICAL INTERCONNECT FOR COMPACT SWITCHES" (DUTCH INVENTORS)
    Media naam/outletUS Fed News
    LandVerenigde Staten van Amerika
    Release datum5/11/18
    PersonenOded Raz, Ripalta Stabile