Thermomechanical behaviour of solder joints in electronic packages

  • J.G.A. van Houten

Student thesis: Master

Date of Award31 Aug 1995
Original languageEnglish
SupervisorH.E.H. Meijer (Supervisor 1), P.J.G. Schreurs (Supervisor 2) & J.J.M. de Bever (Supervisor 2)

Cite this

Documents

  • full text

    File: application/pdf, 4.01 MB

    Type: Thesis

'