Thermomechanical behaviour of solder joints in electronic packages

  • J.G.A. van Houten

Student thesis: Master

Abstract

Date of Award31 Aug 1995
Original languageEnglish
SupervisorH.E.H. Meijer (Supervisor 1), Piet Schreurs (Supervisor 2) & J.J.M. de Bever (Supervisor 2)

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